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Likesmile Silicon Wafer Edge Profiling Machine for Semiconductor Industry
US$7,000.00
1 Piece

Product profile

Customization

Available

Warranty

1 Year

Application

Silicon Wafers

Model NO.

BW

Voltage

380 V

Core Components

PLC

Machinery Test Report

Provided

Key Selling Points

Automatic

Video Outgoing-Inspection

Provided

Power (Kw)

2

Weight (Kg)

350

Grinding Disc Size

4 Inches

Workpiece Size

3-6 Inches

Grinding Wheel Speed

0-4500rpm Adjustable

Wafer Center Positioning Accuracy

≤±0.1mm

Grinding Speed

1mm/S-50mm/S

Adhesion Force

Better Than -80kpa

Main Motor Speed

0-90rpm

Transport Package

1560X700X940mm

Trademark

BW

Origin

Jiangsu, China

Key features

Automatic Operation: CNC system automatically grinds wafer edges with precise trajectory control.
Wide Size Compatibility: Processes 3-6 inch silicon wafers with adjustable grinding speed from 1-50mm/s.
Adjustable Parameters: Features 0-4500rpm adjustable grinding wheel speed and 0-90rpm main motor speed.
Vacuum Chuck Fixing: Wafer is securely placed and fixed on a vacuum chuck for stable processing.
Semi-Automatic Workflow: Requires only manual loading and unloading; grinding is fully automated.
Full Customization Available: Supports customization from samples, designs, and flexible minor modifications.
1-Year Warranty Coverage: Includes 1-year warranty with provided machinery test reports for quality assurance.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the warranty period for this machine?
A:
The equipment comes with a 1-year warranty and includes a provided machinery test report.
Q:Can this machine process different wafer sizes?
A:
Yes, it accommodates various wafer sizes and materials, specifically 3-6 inch wafers.
Q:Is the machine fully automatic?
A:
It is semi-automatic; it requires manual loading and unloading but performs automatic grinding.
Q:What are the customization options available?
A:
We offer full customization, customization from samples, customization from designs, and flexible minor customization.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.

Send Inquiry

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