Powered by Made-in-China.com
Silicon Wafer Edge Grinding Machine for Semiconductor Yield Improvement
US$7,000.00
1 Piece
Product profile
Customization
AvailableWarranty
1 YearApplication
Silicon WafersModel NO.
BWVoltage
380 VCore Components
PLCMachinery Test Report
ProvidedKey Selling Points
AutomaticVideo Outgoing-Inspection
ProvidedPower (Kw)
2Weight (Kg)
350Grinding Disc Size
4 InchesWorkpiece Size
3-6 InchesGrinding Wheel Speed
0-4500rpm AdjustableWafer Center Positioning Accuracy
≤±0.1mmGrinding Speed
1mm/S-50mm/SAdhesion Force
Better Than -80kpaMain Motor Speed
0-90rpmTransport Package
1560X700X940mmTrademark
BWOrigin
Jiangsu, ChinaKey features
High Precision Control: Precisely controls chamfer angle, size, and surface roughness with adjustable cutting speed and depth.
Wide Wafer Compatibility: Processes 3-6 inch wafers of various sizes and materials with high accuracy.
Flexible Customization: Offers full customization, minor customization, and flexible options from samples or designs.
Semi-Automatic Operation: Requires only manual loading and unloading while the system automatically performs grinding.
Vacuum Chuck Fixation: Utilizes a vacuum chuck to securely place and fix the wafer during high-speed rotation.
Adjustable Grinding Speed: Features a grinding wheel speed range of 0-4500rpm and grinding speed of 1-50mm/S.
Core PLC Components: Equipped with reliable PLC core components for stable and precise CNC system control.
Comprehensive Testing: Includes provided machinery test reports and video outgoing inspections for quality assurance.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.49h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for this machine?
A:
The equipment comes with a 1-year warranty.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:Can this machine handle different wafer sizes?
A:
Yes, it accommodates wafers ranging from 3 to 6 inches.
Q:Is customization available for this equipment?
A:
Yes, we offer full customization, minor customization, and flexible options based on samples or designs.
Q:What are the lead times for delivery?
A:
The average lead time is one month, regardless of whether it is peak season or off-season.
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Semiconductor Silicon Wafer Grinding Machine for IC Chip
US$6,500.00-7,000.00
1 Piece(MOQ)
Semiconductor Wafer Edge Profiling Machine for Microelectronics
US$7,000.00
1 Piece(MOQ)
Silicon Wafer Cleaning Machine Best Solution for Semiconductor
US$6,500.00-7,000.00
1 Piece(MOQ)
Semiconductor Wafer Edge Grinding Machine for Silicon Processing
US$7,000.00
1 Piece(MOQ)
IC Wafer Edge Grinding Machine Supplier for Semiconductor Industry
US$7,000.00
1 Piece(MOQ)
Silicon Wafer Cleaning Machine for Semiconductor Fab
US$6,500.00-7,000.00
1 Piece(MOQ)
Semiconductor Wafer Wet Cleaning Machine for Silicon Wafer
US$6,500.00-7,000.00
1 Piece(MOQ)
Low Price Sale High Precision Cold Drawing Machine for Semiconductor Equipment Tube and High Purity Metal Pipe
US$10,000.00-80,000.00
1 Piece(MOQ)
CNC Wire Saw Machine for Semiconductor Wafer Processing
US$6,500.00-7,000.00
1 Piece(MOQ)
Automatic Hydraulic Surface Grinding Machine for Metal Cutting Work 618s
US$3,500.00-3,900.00
1 Piece(MOQ)
Automatic Long Blade Grinding Machine for Veneer Production Line Woodworking Equipment
US$10,000.00
1 Piece(MOQ)
High-Performance Stainless Steel Grinding Wheel Machine for Precision Pipe Finishing
US$14,492.00-21,739.00
1 Set(MOQ)
Cutting-Edge Tablet Press Machine for Efficient Pill Production Innovative Pill Manufacturing Tablet Press for Optimal Output
US$55,000.00-125,000.00
1 Piece(MOQ)
Automatic Industrial Knife Grinding Equipment for Rotary Peeling Machine Veneer Machinery
US$10,000.00
1 Piece(MOQ)
Automatic Knife Grinding Machine for Rotary Peeling Machine Veneer Production Line
US$10,000.00
1 Piece(MOQ)
Automatic Hydraulic Surface Grinding Machine for Metal Tat618s
US$3,500.00-3,900.00
1 Piece(MOQ)
High Precision Cold Drawing Machine for Semiconductor Equipment Tube and High Purity Metal Pipe
US$10,000.00-80,000.00
1 Piece(MOQ)
CNC Oscillating Knife Gasket Cutting Machine for Rubber Silicone PTFE Non Asbestos Gasket High Precision Automatic Cutter
US$10,500.00-12,500.00
1 Piece(MOQ)








