Powered by Made-in-China.com
Silicon Wafer Edge Grinding Machine for Semiconductor Yield Improvement
US$7,000.00
1 Piece
Product profile
Customization
AvailableWarranty
1 YearApplication
Silicon WafersModel NO.
BWVoltage
380 VCore Components
PLCMachinery Test Report
ProvidedKey Selling Points
AutomaticVideo Outgoing-Inspection
ProvidedPower (Kw)
2Weight (Kg)
350Grinding Disc Size
4 InchesWorkpiece Size
3-6 InchesGrinding Wheel Speed
0-4500rpm AdjustableWafer Center Positioning Accuracy
≤±0.1mmGrinding Speed
1mm/S-50mm/SAdhesion Force
Better Than -80kpaMain Motor Speed
0-90rpmTransport Package
1560X700X940mmTrademark
BWOrigin
Jiangsu, ChinaKey features
High Precision Control: Precisely controls chamfer angle, size, and surface roughness with adjustable cutting speed and depth.
Wide Wafer Compatibility: Processes 3-6 inch wafers of various sizes and materials with high accuracy.
Flexible Customization: Offers full customization, minor customization, and flexible options from samples or designs.
Semi-Automatic Operation: Requires only manual loading and unloading while the system automatically performs grinding.
Vacuum Chuck Fixation: Utilizes a vacuum chuck to securely place and fix the wafer during high-speed rotation.
Adjustable Grinding Speed: Features a grinding wheel speed range of 0-4500rpm and grinding speed of 1-50mm/S.
Core PLC Components: Equipped with reliable PLC core components for stable and precise CNC system control.
Comprehensive Testing: Includes provided machinery test reports and video outgoing inspections for quality assurance.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤7.29h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for this machine?
A:
The equipment comes with a 1-year warranty.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:Can this machine handle different wafer sizes?
A:
Yes, it accommodates wafers ranging from 3 to 6 inches.
Q:Is customization available for this equipment?
A:
Yes, we offer full customization, minor customization, and flexible options based on samples or designs.
Q:What are the lead times for delivery?
A:
The average lead time is one month, regardless of whether it is peak season or off-season.
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
IC Wafer Edge Grinding Machine for High Precision Edge Control
US$7,000.00
1 Piece(MOQ)
Semiconductor Silicon Wafer Lapping Machine for High Yield
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Cleaning Machine Best Solution for Semiconductor
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Grinding Machine for Semiconductor Factory
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Thinning Machine for Semiconductor Automation
US$6,500.00-7,000.00
1 Piece(MOQ)
Semiconductor Wafer Wet Cleaning Machine for Silicon Wafer
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Cleaning Machine for Semiconductor Fab
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Cleaning Machine for Microelectronics Industry
US$6,500.00-7,000.00
1 Piece(MOQ)
Laboratory Use paint Three Roll Milling Grinding Machine for Chemicals Use
US$600.00-635.00
1 Piece(MOQ)
Cutting-Edge Tablet Press Machine for Efficient Pill Production Innovative Pill Manufacturing Tablet Press for Optimal Output
US$55,000.00-125,000.00
1 Piece(MOQ)
Three Roll Mill Triple Roller Milling Machine 3 Roller Mill for Paint Ink Pigment Rolling Mill Grinding Mill Product
US$4,500.00-4,750.00
1 Piece(MOQ)
Plasma Surface Treatment Machine for Wafer Processing
US$2,500.00-3,000.00
1 Piece(MOQ)
Silicone Coating Machine for Narrow Belt
US$12,800.00
1 Set(MOQ)
Edge Aligning High Speed Slitting Machine for Perfect Electrode Quality
US$5,000.00-10,000.00
1 Piece(MOQ)
Eiga High Yield 15-53μm Fine Spherical Metal Powder Making Machine for 3D Printer Additive Manufacturing
US$155,000.00-295,000.00
1 Set(MOQ)
CNC Oscillating Knife Gasket Cutting Machine for Rubber Silicone PTFE Non Asbestos Gasket High Precision Automatic Cutter
US$10,500.00-12,500.00
1 Piece(MOQ)