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Silicon Wafer Thinning Machine for Semiconductor Factory
US$7,000.00
1-2 Pieces
US$6,500.00
3+ Pieces

Product profile

Customization

Available

Warranty

1 Year

Type

Double Side Lapping Machine

Model NO.

BW

Voltage

380 V

CNC or Not

CNC

Core Components

PLC

Machinery Test Report

Provided

Power (Kw)

5.5

Weight (Kg)

1800

Machining Accuracy

High Precision

Applicable Industries

Grinding Industry

Installation Method

Floor-Standing

Grinding Wheel Speed

3000(Rpm)

Transport Package

1700*1300*2170(mm)

Trademark

BW

Origin

Jiangsu, China

Key features

Integrated Grinding Process: Combines rough grinding and fine grinding into a single integrated process for silicon wafers.
High Precision Control: Uses PLC, grating ruler, and servo control for a fully closed-loop system ensuring high machining accuracy.
Dual Spindle Design: Lower spindle carries products and switches between rough and fine grinding positions automatically.
Stable Operation: Designed for stable operation with high processing precision suitable for semiconductor factories.
Flexible Customization: Offers full customization, minor customization, and flexible options from samples or designs.
CNC Technology: Equipped with CNC capabilities for precise and automated control of the thinning process.
Compact Floor-Standing: Floor-standing installation method with a weight of 1800 Kg, suitable for dedicated factory spaces.
1-Year Warranty: Comes with a 1-year warranty covering core components and machinery performance.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.43h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the warranty period for this machine?
A:
The machine comes with a 1-year warranty.
Q:Can this machine perform both rough and fine grinding?
A:
Yes, it achieves integrated rough grinding and fine grinding in one process.
Q:What control system does the machine use?
A:
It adopts a PLC, grating ruler, and servo control to form a fully closed-loop control system.
Q:Is customization available for this equipment?
A:
Yes, we offer full customization, minor customization, and flexible options from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.

Send Inquiry

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