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Mini LED Die Bonder Semiconductor Packaging Equipment for Semiconductor Electronic Product Manufacturing
US$20,000.00
1 Piece
Product profile
Condition
UsedSpeed
Medium SpeedPrecision
High PrecisionModel NO.
Die BonderCertification
CEWarranty
6 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterProduct Name
LED High-Speed Die BonderModel
LED High-Speed Die BonderApplication
Semiconductor PackagingPlacement Speed
40000Transport Package
Wooden CaseSpecification
1700*1000*1800mm(L*W*H)Trademark
mastersmtOrigin
ChinaHS Code
8479909090Production Capacity
2000/YearCompany profile
Shenzhen Master SMT Mech-Elec. Co., Ltd.Guangdong, China
Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableAverage Response Time: ≤10.10h
About Our Factory & Business Background
AddressRoom 401, Yongyi International Stationery City, No. 68 Guangshen Road (Shajing Section), Shangliao Community, Xinqiao Street, Bao 'an District, Shenzhen
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsSMT Machine and Spare Parts Accessories
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:Shenzhen Master SMT Mech-Elec. Co., Ltd.
Shenzhen Master SMT Mech-Elec. Co., Ltd.*Content:
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