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Beol Feol Fab Semiconductor Device Fabrication Vertical Grinder Wafer Back Grinder Mdfd-320
US$15,000.00-50,000.00
1 Piece
Product profile
Customization
AvailableSpecification
1125*2000*1750mmTrademark
minder-hightechModel NO.
MDFD-320Origin
GuangzhouHS Code
8015809090Production Capacity
200PCS/Yearpcs/YearKey features
Wide Sucker Size Range: Supports chuck diameters from 320mm to 600mm for versatile wafer processing.
High Precision Grinding: Achieves flatness of +/-2um and location accuracy of 3um for semiconductor thinning.
Adjustable Speed Control: Grinding wheel speed adjustable from 3000-8000 RPM via frequency control.
Multi-Material Application: Suitable for silicon wafers, ceramics, glass, quartz, and sapphire thinning.
High Precision Feeding: Guide screw feeding rate adjustable from 0.001 to 5mm/min with grating ruler check.
Flexible Sucker Options: Can be equipped with either electromagnetism sucker or vacuum sucker.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.51h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What materials can this grinder process?
A:
It is mainly used for silicon wafers, ceramics, glass, quartz crystals, sapphire, and semiconductors precision thinning.
Q:What is the range of chuck diameter?
A:
The sucker (chucktable) diameter ranges from D320mm to D600mm.
Q:What is the grinding wheel size?
A:
The grinding wheel diameter is D150-D200mm, depending on the sucker diameter.
Q:What is the maximum workpiece thickness?
A:
The machine can handle workpiece thicknesses between 0.8mm and 50mm.
Q:What is the precision of the machine?
A:
It features a flatness of +/-2um (50*50) and a location accuracy of 3um.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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