What is the lead time for this equipment?

The average lead time is one month for both peak season and off-season.

What are the payment terms for this product?

The accepted term of payment is T/T.

What is the warranty or support policy?

The company provides technical support and spare parts logistics, with engineers available for assistance.

Wafer Fab Fab Feol Beol Semiconductor Device Fabrication Horizontal Back Grinder Mdym-230wh Mdym-300wh

Name: Wafer Fab Fab Feol Beol Semiconductor Device Fabrication Horizontal Back Grinder Mdym-230wh Mdym-300wh
Brand: Guangzhou Minder-Hightech co.,Ltd
SKU: 1987619675

Guangdong, ChinaGuangzhou Minder-Hightech co.,Ltd

US$15,000.00-50,000.00

1 Piece

Product profile

Customization

Available

Specification

1350*600*1600

Trademark

minder-hightech

Model NO.

MDYM-230WH MDYM-300WH

Origin

Guangzhou

HS Code

8015809090

Production Capacity

200PCS/Yearpcs/Year

Key features

High Precision Grinding: Grinds wafers to 80um thickness with planeness and parallelism of +/-0.002mm.

High Speed Performance: LED sapphire substrate grinding up to 48um/minute; silicon wafer up to 250um/minute.

Wafer Protection Technology: Automatic aiming and torque testing prevent wafer breakage during grinding.

Low Drag Force Design: Vacuum or electromagnetic chucking ensures low drag force for fragile materials.

Versatile Material Application: Suitable for LED sapphire, quartz crystal, silicon wafers, ceramics, and germanium plates.

Adjustable Speed Control: Material spindle speed 0-1000rpm; grinding wheel speed 0-2000rpm for optimal results.

Multiple Model Options: Available in 5 models (YM-150WH to YM-300WH) with max material sizes from 150mm to 300mm.

Automatic Operation: Features auto-aiming, torque testing, and automatic speed adjustment for high productivity.

Company profile

Guangzhou Minder-Hightech co.,Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.98h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China

Registered Capital1,000,000 RMB

Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder

R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30

Main MarketsNorth America, Europe

Overseas Agent/BranchNo

Product Q&A

Q:What materials can this horizontal back grinder process?

It is suitable for high hardness, thin, and high precision products like LED sapphire substrate, quartz crystal, silicon wafer, ceramic, wolfram plate, and germanium plate.

Q:What is the grinding precision of the machine?

The machine can grind wafers to 80um with planeness and parallelism of +/-0.002mm.

Q:How fast can the machine grind different materials?

LED sapphire substrate can be ground at 48um/minute, while silicon wafer can reach 250um/minute.

Q:Does the machine have features to prevent wafer breakage?

Yes, it features automatic aiming, actual grinding torque testing, and automatic speed adjustment to avoid breaking the wafer.

Q:What are the available models and their maximum material sizes?

Models include YM-150WH (150mm), YM-180WH (180mm), YM-200WH (200mm), YM-230WH (230mm), and YM-300WH (300mm).