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High Precision Fine Surface Flat Grinder Lapper Polishing Machine for Semiconductor Wafer
US$50,000.00-80,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
MDType
Stone Polishing MachineControl
CNCAutomation
Semi-automaticPrecision
High PrecisionApplication
Semicon WaferType for Grinding Machine
Special Grinding MachineGrinding Machine Type
Barrel Polishing MachineGrinding Method
Wet GrindCertification
CECondition
NewTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
1000Key features
High Precision Polishing: Removes 95% of surface defects for highly flat semiconductor wafers.
Compact Desktop Design: Suitable for laboratories, research rooms, and small production environments.
Low Pressure Processing: Prevents damage to samples by applying slight pressure during operation.
Adjustable Swing Arm: Swing amplitude adjustable from 0 to 15 degrees with uniform speed control.
Precise Liquid Control: Drip rate adjustable from 1 to 100 ml/min for optimal processing.
Dual Workstation Option: Supports two 6-inch fixtures with dual peristaltic pumps and vacuum control.
Full LCD/Touch Control: Features full LCD screen or touch screen for program editing and storage.
CE Certified Safety: Meets CE certification standards for industrial safety and compliance.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.08h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:Are your prices negotiable?
A:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
Q:Do you provide sample production services?
A:
We can provide sample production services for you, but you may need to pay some fees.
Q:What is the payment process?
A:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
Q:How is delivery and inspection handled?
A:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
Q:Do you provide installation and debugging services?
A:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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