What is the delivery and inspection process?

After manufacturing is completed, we will send you an acceptance video. You can also come to the site to inspect the equipment.

What is the average lead time?

The average lead time is one month for both peak season and off-season.

Semiconductor Research Desktop Flat Surface Process Polishing Lapping Machine for Silicon Wafer

Name: Semiconductor Research Desktop Flat Surface Process Polishing Lapping Machine for Silicon Wafer
Brand: Guangzhou Minder-Hightech co.,Ltd
SKU: 1965489861

Guangdong, ChinaGuangzhou Minder-Hightech co.,Ltd

US$50,000.00-80,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

Type

Stone Polishing Machine

Control

CNC

Automation

Semi-automatic

Precision

High Precision

Application

Semicon Wafer

Type for Grinding Machine

Special Grinding Machine

Grinding Machine Type

Barrel Polishing Machine

Grinding Method

Wet Grind

Certification

Condition

New

Transport Package

Wooden Case

Trademark

minder-hightech

Origin

China

Production Capacity

1000

Key features

High Precision Polishing: Removes 95% of surface defects for highly flat semiconductor wafers.

Compact Desktop Design: Space-saving model suitable for labs, research rooms, and small production.

Low Pressure Processing: Prevents sample damage by applying slight pressure during grinding.

Adjustable Swing Arm: Swing amplitude adjustable from 0 to 15 degrees with uniform speed control.

Dual Workstation Option: Compatible with two 6-inch fixtures for improved grinding efficiency.

Precise Liquid Control: Drip rate adjustable from 1 to 100 ml/min using dual peristaltic pumps.

Full LCD/Touch Control: Features LCD screen or touch screen for program editing and storage.

Cost-Effective Solution: Low cost design ideal for budget-limited projects and safety ventilation.

Company profile

Guangzhou Minder-Hightech co.,Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.08h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China

Registered Capital1,000,000 RMB

Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder

R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30

Main MarketsNorth America, Europe

Overseas Agent/BranchNo

Product Q&A

Q:What is the warranty period?

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

Q:What is the maximum wafer size supported?

The maximum wafer size for grinding and polishing is 6 inches. The grinding disc diameter is 400mm.

Q:Can you provide sample production services?

We can provide sample production services for you, but you may need to pay some fees.

Q:What are the payment terms?

After the plan is confirmed, you need to pay a deposit first. After the equipment is ready and you pay the balance, we will ship it.

Q:How is installation and debugging handled?

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide a separate quotation for this service fee.