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III-V Semiconductor Materials Fabrication Die Separation Dicing Breaking Scribe Wafer Cleaving Equipment
US$999.00-99,999.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearFunction
Wafer CleavingModel NO.
MDDemoulding
AutomaticCondition
NewCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
DesktopDriven Type
ElectricMould Life
>1,000,000 ShotsTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
100000Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.05h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
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