Powered by Made-in-China.com
Laboratory Uses Diode Laser Tube Inner Lead Wafer Manual Wire Bonder Bond
US$4,500.00-10,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearFunction
Wire BondingModel NO.
MDB-2575Demoulding
Pull CoreCondition
NewCertification
CEWarranty
12 MonthsAutomatic Grade
ManualInstallation
DesktopDriven Type
ElectricMould Life
300,000-1,000,000 ShotsTransport Package
Wooden CaseTrademark
Minder-hightechOrigin
ChinaProduction Capacity
10000Key features
4 Wire Bonder Types: Offers Thin Aluminum, Heavy Aluminum, Gold Wire Ball, and Deep Access Wedge Bonders.
Wide Application Range: Suitable for LEDs, diodes, laser tubes, semiconductors, power modules, and TO packages.
Precise Parameter Control: Features adjustable ultrasonic power (0-30W), bond time, and bond force for different wires.
12-Month Warranty: Comprehensive 12-month warranty coverage with cost-price replacement parts after expiry.
Professional After-Sales: Online technical support and optional on-site installation and debugging by engineers.
Desktop Manual Design: Compact desktop installation suitable for small quantity production, schools, and research.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤5.44h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What types of wire bonders are available?
A:
We provide four types: Thin Aluminum Wire Wedge Bonder (25-75um), Heavy Aluminum Wire Wedge Bonder (75-500um), Gold Wire Ball Bonder (17-50um), and Deep Access Wedge Bonder.
Q:What is the warranty period?
A:
Our equipment comes with a 12-month warranty period. After this, damaged parts are replaced at cost price.
Q:Do you provide installation services?
A:
Yes, we can dispatch engineers to install and debug the equipment at your factory upon arrival. A separate quotation applies for this service.
Q:What are the payment terms?
A:
You need to pay a deposit first. The factory starts preparation, and you pay the balance after the equipment is ready and before shipping.
Q:Can I get a sample before bulk order?
A:
Yes, we can provide sample production services, but you may need to pay some fees for this service.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Polyurethane Direct-Weldable Enameled Wire
US$11.40-11.80
500 kg(MOQ)
Self-Sticking Polyurethane Enameled Conductor Wire
US$11.40-11.80
500 kg(MOQ)
Qipang Wire Guided Missile Slow Motion Guide Wire
US$46.00-50.00
10 Pieces(MOQ)
Adhesive-Enhanced Polyurethane Enameled Wire
US$11.40-11.80
500 kg(MOQ)
Customed Thermocouple Alloy Compensation Bare Element Type T Extension Wire KX/KPX/KNX/KCB
US$21.00-28.00
100 kg(MOQ)
Weld-Ready Polyurethane Enameled Wire
US$11.40-11.80
500 kg(MOQ)
Enameled Wire Scraping Paint Fixed Paint Stripping Machine Desktop Multiple Wires 0.14-1.33mm
US$499.00-1,599.00
1 Set(MOQ)
For Mitsubishi HF104 Four-Axis Electrical Equipment Durable Wire Material
US$44.00-59.00
1 Piece(MOQ)
China High Precision Semiconductor Equipment Supplier at 1150 Asml Used Arf Lithography Machine
US$459,000.00-1,550,000.00
1 set(MOQ)
Semiconductor Wafer Fab Equipment Manufacture Used High-Speed Canon Fpa-5500iz+ I-Line Lithography Machine
US$450,500.00-654,000.00
1 set(MOQ)
Canon Used I-Line Semiconductor Wafer Fab Equipment Fpa 3000 I4 Lithography Machine
US$46,000.00-65,000.00
1 Piece(MOQ)
High-Precision High-Speed Semiconductor Equipment Supplier Asml Xt 1400ei Used Lithography Machine
US$500,000.00-650,000.00
1 set(MOQ)
Semiconductor Premium Quality Scanon Fpa-5500iz Wafer Die Lithography Machine
US$455,500.00-1,554,000.00
1 set(MOQ)
Used Automatic Asml Xt 450 Semiconductor Wafer Fab Lithography Machine
US$450,000.00-580,000.00
1 Piece(MOQ)
Used China Multifunctional Asml Xt 400g Supplier Manufacturers Semiconductor Wafer Fab Equipment Supplier Lithography Machine
US$455,000.00-1,650,000.00
1 Piece(MOQ)
High-Precision Photolithography Machine (4μm Resolution) for 610×630mm Substrate with 2μm Alignment
US$95,000.00-100,000.00
1 Piece(MOQ)
Used Semiconductor Wafer Fab Equipment Asml Xt 1900gi Arf Immersion Lithography Machine
US$440,000.00-580,000.00
1 Piece(MOQ)
High-Precision Photolithography Machine (1.4μm Resolution) for 650×550mm Full Panel & Wafer
US$95,000.00-100,000.00
1 Piece(MOQ)
12-Inch Wafer Stepper Photolithography Machine with 2μm Resolution & 0.25μm Overlay
US$95,000.00-100,000.00
1 Piece(MOQ)
Yfc-37 Silver Contact Rivet Making Machine with Sorting Fuction
US$9,000.00-15,000.00
1 Set(MOQ)