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Manual Eutectic Die Attach Machine / Submicron Semi-Automatic Eutectic Bonding Equipment
US$10,000.00-90,000.001 Piece
Manual Eutectic Die Attach Machine / Submicron Semi-Automatic Eutectic Bonding Equipment
US$10,000.00-90,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
RYW-ETB05BSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterAlignment Accuracy
±0.5μmSubstrate Size
150mm/6-Inch(300mm/12-Inch)Chip Size
0.1~40mmHeating and Cooling Rates
Heat: 1~100℃/S; Cool: >5℃/STransport Package
Wooden CaseSpecification
110kgTrademark
Minder-hightechOrigin
ChinaKey features
Versatile Bonding Processes: Supports flip-chip, ultrasonic, laser, eutectic, and dispensing bonding.
Modular Design: Features a modular structure with flexible configuration for diverse applications.
Wide Application Scope: Suitable for Micro LED, MEMS, sensors, and high-end LED packaging.
Real-time Curve Monitoring: Provides real-time pressure and temperature curve monitoring during bonding.
Cost-Effective Solution: High cost-effectiveness designed for small-batch production and prototyping.
Global Support Network: Products spread to major industrialized countries with reliable service.
CE Certified Quality: Equipped with CE certification ensuring safety and quality standards.
Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.14h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:About Price:
A:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
Q:About Sample:
A:
We can provide sample production services for you, but you may provide some fees.
Q:About Payment:
A:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
Q:About Delivery:
A:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
Q:Installation and Debugging:
A:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
0/4000
Supplier replies will be sent to your registered email
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