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Precision Semicon Wafer Surface Grinding Lapping Polishing Machine
US$50,000.00-80,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
MDType
Stone Polishing MachineControl
CNCAutomation
Semi-automaticPrecision
High PrecisionApplication
Semicon WaferType for Grinding Machine
Special Grinding MachineGrinding Machine Type
Barrel Polishing MachineGrinding Method
Wet GrindCertification
CECondition
NewTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
1000Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.08h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
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*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
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