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Precision Single Side Lapping Polishing Machine for Ceramics Metal Parts Semiconductor Material
US$50,000.00-80,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

MD

Type

Stone Polishing Machine

Control

CNC

Automation

Semi-automatic

Precision

High Precision

Application

Semicon Wafer

Type for Grinding Machine

Special Grinding Machine

Grinding Machine Type

Barrel Polishing Machine

Grinding Method

Wet Grind

Certification

CE

Condition

New

Transport Package

Wooden Case

Trademark

minder-hightech

Origin

China

Production Capacity

1000

Key features

High Precision Grinding: Removes 95% of surface defects for highly flat semiconductor wafers.
Compact Desktop Design: Suitable for laboratories, research rooms, and small production environments.
Low Pressure Processing: Prevents damage to samples by applying slight pressure during operation.
Adjustable Swing Arm: Swing amplitude adjustable from 0 to 15 degrees with uniform speed control.
Precise Drip Control: Drip rate uniformly adjustable from 1 to 100 ml/min.
Full LCD Control: Features full LCD screen for plate speed control between 5-100 rpm.
Dual Workstation Option: Supports dual precision fixtures for 6-inch wafers with peristaltic pumps.
1 Year Warranty: Covers 12 months with cost-price replacement for parts after warranty.

Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤5.44h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo

Product Q&A

Q:Are prices negotiable?
A:
All prices are competitive and negotiable, varying based on configuration and customization complexity.
Q:Do you offer sample production services?
A:
Yes, we can provide sample production services, though some fees may apply.
Q:What is the payment process?
A:
After plan confirmation, a deposit is required. The balance is paid after equipment is ready, followed by shipping.
Q:How is delivery handled?
A:
After manufacturing, an acceptance video is sent. You may also visit the site to inspect the equipment.
Q:Do you provide installation and debugging services?
A:
Yes, engineers can be dispatched to your factory. A separate quotation is provided for this service fee.

Send Inquiry

*To:Guangzhou Minder-Hightech co.,LtdGuangzhou Minder-Hightech co.,Ltd
*Content:
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