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Semiconductor Chips Lab Wire Bonding Machine / Manual Semi-Auto Ball Wedge Wire Bonder
US$51,000.00-80,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDZW-BB1880Speed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
SemiautomaticType
High-speed Chip MounterTransport Package
Wooden CrateSpecification
80kgTrademark
Minder-hightechOrigin
ChinaProduction Capacity
10000Key features
primarily used in industries requiring chip micro-assembly, such as integrated circuit packaging, optical communications, microwave technology, lasers, and sensors.
Suitable for institutions such as chip packaging companies, research institutes, and university laboratories.
Manual and automatic, with the flexibility of manual machine and the consistency of semi-automatic machine;
Based on full closed-loop grating feedback, Z-axis motion accuracy is 1um, more accurate and stable;
Wire arrangement function, manually complete the first wire, automatically complete the rest of the wire bonding, high efficiency.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.46h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:About Price:
A:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
Q:About Sample:
A:
We can provide sample production services for you, but you may provide some fees.
Q:About Payment:
A:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
Q:About Delivery:
A:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
Q:Installation and Debugging:
A:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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