Powered by Made-in-China.com
Scientific Research Small Batch Automatic Desktop Wire Ball Bonder Bonding Machine
US$7,000.00-30,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDZW-MWB150-BSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CrateTrademark
minder-hightechOrigin
ChinaKey features
Customizable Bonding Travel: Standard 200x200mm, customizable up to 250x300mm for specific needs.
Multi-Wire Compatibility: Supports gold, silver, and copper wires via non-standard customization.
Real-Time Visual Control: Dual-camera live view and auto-focus for instant verification of parameters.
Seamless Automation Transition: Backward-compatible with semi-auto and forward-compatible with full-auto models.
SIP Process Optimization: Tailored algorithms for fixed-length looping, bonding, and tearing in SIP apps.
Low Disturbance Platform: High-speed direct-drive technology ensures stability and minimal thermal impact.
Comprehensive Sensing: Global View, Unit View, and real-time CCD observation for precise alignment.
Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.25h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:Is the bonding travel area customizable?
A:
Yes, the standard bonding travel is 200 x 200 mm, but it can be customized up to 250 x 300 mm.
Q:What is the warranty period?
A:
The equipment comes with a 12-month warranty. After the warranty period, replacement parts are charged at cost price.
Q:How is the payment structured?
A:
A deposit is required after plan confirmation. The balance is paid after the equipment is ready, followed by shipment.
Q:Do you provide installation services?
A:
Yes, engineers can be dispatched for installation and debugging upon arrival. A separate quotation applies for this service.
Q:Can the machine handle different wire loop profiles?
A:
Yes, it supports multi-profile real-time control for Electronic Flame-off (EFO) and various looping styles like BBOS and BSOB.
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Asm PT Aerocam Series Wire Bonder, High-Speed Automatic Wire Bonding Machine for IC & LED Packaging
US$23,000.00-40,000.00
1 Piece(MOQ)
K&S 8028PPS Automatic Wire Bonder High Precision LED & IC Bonding Machine 45um Fine Pitch Gold Ball Wire Bonder
US$23,000.00-40,000.00
1 Piece(MOQ)
T O Automatic Ultrasonic Aluminum Wire Welding Press Wire Bonder Bonding Machine
US$45,000.00-65,000.00
1 Piece(MOQ)
K&S Maxum Plus Wire Bonder Automatic Gold Ball Bonding Machine High-Speed LED & IC Packaging Equipment
US$23,000.00-40,000.00
1 Piece(MOQ)
K&S Maxum Plus Automatic Gold Ball Wire Bonder, High-Speed Semiconductor Bonding Machine for IC & LED Packaging
US$23,000.00-40,000.00
1 Piece(MOQ)
Advanced Packaging Manual Semi-Auto Ultrasonic Gold Ball Wedge Wire Bonder Bonding Machine
US$51,000.00-80,000.00
1 Piece(MOQ)
Heavy Wire Bonder Wire Bonding Machine for to Package
US$140,000.00-220,000.00
1 Piece(MOQ)
Semiconductor Wafer Packaging Welding Equipment Laser Vision Micro Desktop Automatic Solidification Machine Die Bonder Bonding
US$116,000.00-150,000.00
1 Piece(MOQ)
Small Size Factory Sale Desktop Automatic SMT P&P Machine Mounting Machine
US$8,000.00
1 Piece(MOQ)
4 Head Small Size High Quality Factory Desktop Automatic SMT P&P Machine PCBA
US$9,600.00-9,800.00
1 Piece(MOQ)
High-Speed Wire Bonding Machine for Production Line
US$7,000.00-70,000.00
1 Piece(MOQ)
Ky Inline SMT 3D Aoi Wire Bonding Aoi Inspection System in SMT Machine
US$125,700.00
1 Piece(MOQ)
Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Advanced Precision Wire Bonding Machines for Semiconductor Production
US$7,000.00-70,000.00
1 Piece(MOQ)
Jaguar-A4 Desktop Automatic Pick and Place Machine for PCBA Assembly
US$11,000.00
1 Piece(MOQ)
Jaguar-A4 Mini Desktop Automatic SMT Pick and Place Machine
US$13,000.00
1 Piece(MOQ)
Semiconductor Machine Semi Automatic Small Manual Used Pick and Place Machine SMT Production Line SMD Machine
US$5,000.00-65,000.00
1 Piece(MOQ)













