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Semiconductor Manufacture Welding Line Inspection Equipment Wire Bonding Wire Bonder Automatic Optical Inspect Wafer Aoi
US$999,999.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearDemoulding
AutomaticCondition
NewCertification
CEWarranty
24 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
>1,000,000 ShotsTrademark
MINDER-HIGHTECHOrigin
ChinaProduction Capacity
1000Key features
AI-Enhanced Defect Detection: Combines traditional algorithms and AI for fast and accurate defect identification.
High Efficiency Output: UPH reaches 40-80 strips/Hour depending on material size.
Wide Compatibility: Track width automatically adjusts from 15 to 100mm for various products.
Comprehensive Inspection Items: Detects 20+ defects including die shedding, offset, cracks, and wire issues.
Real-time Data Mapping: Generates real-time mapping and supports database access from multiple machines.
Flexible Production Reporting: Automatically generates mapping and production reports for quality control.
Modular Design: Equipment can be quickly dismantled in sections and connects with upstream/downstream systems.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.55h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What types of defects can be detected?
A:
It detects die shedding, offset, die reversed, error, silver paste/foreign object, contamination, scratch, chipping, broken edge, die crack, insufficient silver paste, miss wire, ball shedding, abnormal ball, ball offset, 2nd bonding shedding, 2nd bonding offset, 2nd bonding abnormal, broken wire, wire bending, tail length, and foreign objects.
Q:What is the production speed (UPH)?
A:
The UPH is 40-80 strips/Hour, determined by the size of the material strip and the die.
Q:What is the warranty period?
A:
The warranty period is 24 months.
Q:Does the software support automatic track adjustment?
A:
Yes, the software automatically adjusts the track width ranging from 15 to 100mm.
Q:What are the payment terms?
A:
The terms of payment are T/T.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
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