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Wafer Fab Beol Feol Fab Automatic Precision Dicing Machine Integrated Cutting and Cleaning Increase Productivity
US$47,000.00-63,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Transport Package

Wooden Crate

Specification

1200mm*1550mm*1800mm

Trademark

minder-hightech

Origin

Guangzhou

HS Code

8015809090

Production Capacity

200PCS/Yearpcs/Year

Key features

Fully Automatic Operation: Automates wafer loading, alignment, cutting, cleaning, and unloading for increased productivity.
Integrated Cutting and Cleaning: Combines precision dicing and two-fluid cleaning in a single workflow to save time.
High-Power Dual Spindles: Equipped with opposed dual-spindles capable of 6000 to 60000 RPM rotation.
Precision Alignment System: Features NCS and special microscopes on Z1 and Z2 axes to reduce inspection time.
Customizable Groove Depth: Groove depth can be customized or set to <=4mm for various wafer requirements.
High Accuracy Positioning: Achieves single positioning accuracy of <=0.002mm and repeatability of 0.001mm.
Optional Detection Functions: Supports optional tool mark, blade breakage, and workpiece shape detection functions.
Wide Material Compatibility: Suitable for silicon wafers, ceramics, glass, quartz, alumina, and PCB boards.

Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.21h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo

Product Q&A

Q:What is the warranty period for this machine?
A:
The machine comes with a 1-year warranty and 1 year of after-sales service.
Q:Can the groove depth be customized?
A:
Yes, the groove depth can be customized or set to less than or equal to 4mm.
Q:What is the lead time for this equipment?
A:
The average lead time is one month, regardless of peak or off-peak seasons.
Q:What payment terms are accepted?
A:
The accepted payment term is T/T (Telegraphic Transfer).
Q:Which industries can use this dicing machine?
A:
It is applicable for IC, optoelectronics, communications, LED packaging, QFN, DFN, and BGA packaging.

Send Inquiry

*To:Guangzhou Minder-Hightech co.,LtdGuangzhou Minder-Hightech co.,Ltd
*Content:
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