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Wafer Fabrication Feol Beol Fab CMP Lapping Polishing Machine for Silicon Wafer
US$60,000.00-100,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
0Certification
CECondition
NewNumber of Station
4Plate Rotate Speed
0-90 RpmCylinder Bar Rotate Speed
0-40 RpmTotal Weight
2200kgFloor Space
2200*1200mmTransport Package
SeaSpecification
2000KGTrademark
MINDERHIGHTECHOrigin
GuangzhouHS Code
8501109101Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.55h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
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*To:Guangzhou Minder-Hightech co.,Ltd
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