Premium Tantalum Rods for Etching Fixtures and Sputtering Targets

Ultra-high purity tantalum rod with tantalum content no less than 99.995%, strictly limited trace heavy metal and radioactive impurities to avoid wafer contamination during chip manufacturing.

Uniform and controllable grain structure with stable sputtering performance, which ensures consistent thin film deposition rate and excellent thickness uniformity on silicon wafer surface.

Outstanding resistance to halogen corrosive gas and plasma etching environment, long service life in semiconductor vacuum process chamber.

Extremely low outgassing rate under high vacuum condition, will not introduce volatile impurities to pollute the ultra-clean production cavity.

Superior ductility and precision machinability, can be processed into sputtering target blank, etching electrode and fixture parts for wafer processing equipment.

Fully non-magnetic material, no interference with equipment sensor, signal detection and automatic control modules in chip production line.

Precise dimensional tolerance control, diameter and length can be customized strictly according to semiconductor equipment fixture drawings.

Stable thermal conductivity and thermal shock resistance, not easy to deform or crack under alternating plasma heating and vacuum cooling cycles.

Adopts electron beam vacuum melting and multi-pass cold drawing process, compact internal structure without pores and segregation defects.

Standard specifications are in stock, drawing customized processing is supported, complete third-party impurity inspection and material certification are provided.