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Ultra High Purity Ta1 Tantalum Rod for Semiconductor Sputtering Target
US$492.00
1-49 kg
US$453.00
50+ kg

Product profile

Customization

Available

Characteristic

Stable Electrical Behavior, Low Weight

Protection

Resistance to Corrosion, High Melting Point

Model NO.

Ta1

Usage

Electronics

Shape

Solid Round Tantalum Rod

Concentrate or Not

Non-concentrate

Product Name

Ultra High Purity Tantalum Rod for Semiconductor C

Grade

Ta1

Purity

≥99.95% (3n5), 99.99% (4n) Optional

Melting Point

2996℃

MOQ

1gk

Lead Time

Stock 15-20days, Custom 20-25days

Gas Impurity Control

Ultra-Low O/C/N/H Content, Low Outgassing Rate

Diameter Range

3mm-100mm, Ultra-Thin Micro Rod Customizable

Length Range

10mm-2000mm, Arbitrary Cutting Supported

Surface State

Pickled Matte / Fine Mirror Polishing (Ra≤0.8μm)

Processing State

Full Vacuum Stress Relief Annealed, Grain Controll

Core Technical Index

U & Th ≤10ppb, Ultra-Low O/C/N/H Gas Impurity

Inspection Certificates

Gdms Element Report, Leco Gas Test, SGS Metallurgy

Melting Technology

Vacuum Electron Beam Single Crystal Melting

Sputtering Performance

Stable Sputter Yield, Uniform Thin Film Deposition

Origin

Baoji, Shaanxi, China

Production Capacity

500 Tons/Year

Key features

Vacuum electron beam single crystal melting raw material, minimal trace metallic impurities
Ultra-high purity grade, optional 3N5/4N/4N5 to match different wafer process standards
Ultra-low O/C/N/H gas content, extremely low outgassing in high vacuum coating chamber
Controlled rolling & annealing, uniform grain and stable crystal texture for consistent sputtering
Dense internal structure without pores & segregation, no local abnormal sputtering area
Ultra-low impurity migration, avoid silicon wafer surface contamination during thin film deposition
Excellent precision machinability, support grinding, threading and copper backplate bonding
Super smooth polished surface optional, no residual oxide layer before target manufacturing
Non-magnetic property, no interference to precision semiconductor coating equipment
Meet international semiconductor material audit standards, complete factory inspection records

Company profile

Shaanxi Mingsheng Guangpu Metal Materials Co., Ltd.
Importers and ExportersIn-stock CapacityFast DeliveryManagement Certification
Business Type: Manufacturer/Factory CertifiedCustomization Options: Customization from Samples, Customization from Designs CertifiedNearest Port: Shanghai PortAverage Response Time: ≤0.72h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, CFR, EXW

AI-Powered supplier vetting

SummaryShaanxi Mingsheng Guangpu Metal Materials Co., Ltd. is a trade company located in Baoji, Shaanxi, specializing in the production, R&D, and sales of titanium, nickel, and zirconium materials. The company has an ISO9001:2015 certification, exports primarily to East Asia, and has a significant export sales percentage. While its financial credibility is supported by an AAA credit rating, other areas such as after-sales service capability and innovation capability lack sufficient information for a comprehensive assessment.
Supplier typeThe supplier is classified as a trade company located in Baoji, Shaanxi, focusing on manufacturing titanium, nickel, and zirconium materials.
CertificationsThe company holds an ISO9001:2015 certificate, indicating a recognized quality management system.
Financial creditThe supplier has an AAA enterprise credit rating, suggesting strong financial credibility.
Production capacityThe supplier is involved in precision forging and processing, with the ability to produce a variety of titanium and nickel products.
Customization capabilityThe company can design and manufacture non-standard chemical equipment and specialized titanium and nickel products based on user requirements.

Product Q&A

Q:What tantalum grade is used for semiconductor wafer coating?
A:
Ta1 UNS R05200 electronic semiconductor grade, ultra low radioactive impurities.
Q:What purity levels can you supply for chip manufacturing?
A:
Standard 99.95%, customized 99.99% and ultra-high 99.995% purity.
Q:Why strictly control U and Th elements for semiconductor tantalum rod?
A:
Radioactive trace elements will cause hidden circuit defects on silicon wafer thin film.
Q:Will this tantalum rod release lots of gas inside vacuum coating chamber?
A:
Ultra-low O/C/N/H gas impurities, extremely low outgassing rate to keep chamber clean.
Q:Is pure tantalum magnetic and disturb coating equipment sensors?
A:
Pure tantalum is non-magnetic, no interference to precision coating monitoring parts.

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