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Ultra High Purity Ta1 Tantalum Rod for Semiconductor Sputtering Target
US$492.00
5-49 kg
US$453.00
50+ kg

Product profile

Customization

Available

Characteristic

Stable Electrical Behavior, Low Weight

Protection

Resistance to Corrosion, High Melting Point

Model NO.

Ta1

Usage

Electronics

Shape

Solid Round Tantalum Rod

Concentrate or Not

Non-concentrate

Product Name

Ultra High Purity Tantalum Rod for Semiconductor C

Grade

Ta1

Purity

≥99.95% (3n5), 99.99% (4n) Optional

Melting Point

2996℃

MOQ

5gk

Lead Time

Stock 15-20days, Custom 20-25days

Gas Impurity Control

Ultra-Low O/C/N/H Content, Low Outgassing Rate

Diameter Range

3mm-100mm, Ultra-Thin Micro Rod Customizable

Length Range

10mm-2000mm, Arbitrary Cutting Supported

Surface State

Pickled Matte / Fine Mirror Polishing (Ra≤0.8μm)

Processing State

Full Vacuum Stress Relief Annealed, Grain Controll

Core Technical Index

U & Th ≤10ppb, Ultra-Low O/C/N/H Gas Impurity

Inspection Certificates

Gdms Element Report, Leco Gas Test, SGS Metallurgy

Melting Technology

Vacuum Electron Beam Single Crystal Melting

Sputtering Performance

Stable Sputter Yield, Uniform Thin Film Deposition

Origin

Baoji, Shaanxi, China

Production Capacity

500 Tons/Year

Key features

Vacuum electron beam single crystal melting raw material, minimal trace metallic impurities
Ultra-high purity grade, optional 3N5/4N/4N5 to match different wafer process standards
Ultra-low O/C/N/H gas content, extremely low outgassing in high vacuum coating chamber
Controlled rolling & annealing, uniform grain and stable crystal texture for consistent sputtering
Dense internal structure without pores & segregation, no local abnormal sputtering area
Ultra-low impurity migration, avoid silicon wafer surface contamination during thin film deposition
Excellent precision machinability, support grinding, threading and copper backplate bonding
Super smooth polished surface optional, no residual oxide layer before target manufacturing
Non-magnetic property, no interference to precision semiconductor coating equipment
Meet international semiconductor material audit standards, complete factory inspection records

Company profile

Shaanxi Mingsheng Guangpu Metal Materials Co., Ltd.
Importers and ExportersIn-stock CapacityFast DeliveryManagement Certification
Business Type: Manufacturer/Factory CertifiedCustomization Options: Customization from Samples, Customization from Designs CertifiedNearest Port: Shanghai PortAverage Response Time: ≤0.54h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): FOB, CIF, CFR, EXW

About Our Factory & Business Background

AddressRoom 1402, 14th Floor, Building 10, Hongxin International, Gaoxin 5th Road, High Tech Development Zone, Baoji City, Shaanxi Province, Baoji, Shaanxi, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Supply Chain Partners15

Our Production Capability & Technical Expertise

Main ProductsTitanium Rod, Hafnium Pipe, Chromium Ring, Titanium Alloy Plate, Nickel Sheet, Tungsten Crucible, Molybdenum Plate, Tantalum Spinning Parts, Niobium Wire, Zirconium Foil
Inspection Type for Finished Products100% inspection(Visual inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff

Our Industry Experience & Global Business Record

Year of Establishment2023-07-26
Main MarketsEast Asia(Japan/ South Korea)
Repeat Buyers Choice30%~50%

Our Certifications, Standards & Industry Recognition

Management System CertificationISO9001:2015

Product Q&A

Q:What tantalum grade is used for semiconductor wafer coating?
A:
Ta1 UNS R05200 electronic semiconductor grade, ultra low radioactive impurities.
Q:What purity levels can you supply for chip manufacturing?
A:
Standard 99.95%, customized 99.99% and ultra-high 99.995% purity.
Q:Why strictly control U and Th elements for semiconductor tantalum rod?
A:
Radioactive trace elements will cause hidden circuit defects on silicon wafer thin film.
Q:Will this tantalum rod release lots of gas inside vacuum coating chamber?
A:
Ultra-low O/C/N/H gas impurities, extremely low outgassing rate to keep chamber clean.
Q:Is pure tantalum magnetic and disturb coating equipment sensors?
A:
Pure tantalum is non-magnetic, no interference to precision coating monitoring parts.

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