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4 Inches Semi-Automatic Wafer Grinder Dag810
US$180,000.00
1 Piece

Product profile

Customization

Available

Type

Disc Grinder

Power Source

Electricity

Model NO.

HG5140

Object

Saw Blade

Application

Semi-Conductor

Disc(Wheel) Type

Grinding Disc

Material

Aluminum Alloy

Working Style

High-speed universal

Disc Diameter

8 Inches

Variable Speed

With Variable Speed

Weight

1500kgs

Wokpiece Size

4/5/6/8

Power(kVA)

13kVA(Three Phase,380V)

Air Pressure

0.5-0.8 Max

Wheel Coolant

0.3-0.4max

Transport Package

Standard Export Wooden Case

Specification

700x1890x1750

Trademark

OEM

Origin

China

HS Code

8486102000

Production Capacity

500PCS/PC/Year

Key features

Wide Variable Speed: Spindle rotation speed range 1000-6000rpm for versatile processing.
Multi-Size Compatibility: Supports thinning of 4, 5, 6, and 8-inch wafers simultaneously.
High Rigidity Spindle: High power spindle with low vibration for stable high-speed operation.
Advanced Control System: IPC bus control mode with 15-inch LCD screen and user-friendly GUI.
Compact Design: Small footprint (700*1890*1750mm) with high reliability.

Company profile

Ninghai County Chalu Jinbaili Daily Necessities Store
High Repeat Buyers ChoiceYears of Export ExperienceFast DeliveryCustomization from Samples
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2016-07-08Nearest Port: Ningbo, ShanghaiAverage Response Time: ≤2.14hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP

About Our Factory & Business Background

AddressNo. 1 Renmin North Road Gongxing Building Chalu Ninghai, Zhejiang China, Ningbo, Zhejiang, China
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsAluminum Foil, Heat Shrinkable Tube, Aluminum Case, Etched Aluminum Foil, Masking Tape, Pet Film, Rubber Seal, Con Paper for Electrolytic Capacitor, Tab Anode Foil, Semi-Conductor Device

Our Industry Experience & Global Business Record

Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

Product Q&A

Q:What wafer sizes are supported?
A:
The machine is compatible with 4, 5, 6, and 8-inch wafers.
Q:What is the minimum grind thickness?
A:
The minimum wafer thickness that can be ground is 100um.
Q:What is the spindle speed range?
A:
The spindle rotation speed ranges from 1000 to 6000rpm.
Q:What materials can be processed?
A:
It is suitable for processing resin material substrates, SiC, etc.
Q:What are the power requirements?
A:
Power requirement is 13KVA (three phase, 380V).

Send Inquiry

*To:Ninghai County Chalu Jinbaili Daily Necessities StoreNinghai County Chalu Jinbaili Daily Necessities Store
*Content:
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