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4 Inches Semi-Automatic Wafer Grinder Dag810
US$180,000.00
1 Piece
Product profile
Customization
AvailableType
Disc GrinderPower Source
ElectricityModel NO.
HG5140Object
Saw BladeApplication
Semi-ConductorDisc(Wheel) Type
Grinding DiscMaterial
Aluminum AlloyWorking Style
High-speed universalDisc Diameter
8 InchesVariable Speed
With Variable SpeedWeight
1500kgsWokpiece Size
4/5/6/8Power(kVA)
13kVA(Three Phase,380V)Air Pressure
0.5-0.8 MaxWheel Coolant
0.3-0.4maxTransport Package
Standard Export Wooden CaseSpecification
700x1890x1750Trademark
OEMOrigin
ChinaHS Code
8486102000Production Capacity
500PCS/PC/YearKey features
Wide Variable Speed: Spindle rotation speed range 1000-6000rpm for versatile processing.
Multi-Size Compatibility: Supports thinning of 4, 5, 6, and 8-inch wafers simultaneously.
High Rigidity Spindle: High power spindle with low vibration for stable high-speed operation.
Advanced Control System: IPC bus control mode with 15-inch LCD screen and user-friendly GUI.
Compact Design: Small footprint (700*1890*1750mm) with high reliability.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2016-07-08Nearest Port: Ningbo, ShanghaiAverage Response Time: ≤2.14hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP
About Our Factory & Business Background
AddressNo. 1 Renmin North Road Gongxing Building Chalu Ninghai, Zhejiang China, Ningbo, Zhejiang, China
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsAluminum Foil, Heat Shrinkable Tube, Aluminum Case, Etched Aluminum Foil, Masking Tape, Pet Film, Rubber Seal, Con Paper for Electrolytic Capacitor, Tab Anode Foil, Semi-Conductor Device
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Product Q&A
Q:What wafer sizes are supported?
A:
The machine is compatible with 4, 5, 6, and 8-inch wafers.
Q:What is the minimum grind thickness?
A:
The minimum wafer thickness that can be ground is 100um.
Q:What is the spindle speed range?
A:
The spindle rotation speed ranges from 1000 to 6000rpm.
Q:What materials can be processed?
A:
It is suitable for processing resin material substrates, SiC, etc.
Q:What are the power requirements?
A:
Power requirement is 13KVA (three phase, 380V).
Send Inquiry
*To:
Ninghai County Chalu Jinbaili Daily Necessities Store
Ninghai County Chalu Jinbaili Daily Necessities Store*Content:
Supplier replies will be sent to your registered email
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