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8 Inches Fully Automatic Wafer Grinder Dfg8560
US$180,000.00
1 Piece

Product profile

Customization

Available

Type

Disc Grinder

Power Source

Electricity

Model NO.

HG5260

Object

Saw Blade

Application

Semi-Conductor

Disc(Wheel) Type

Grinding Disc

Material

Aluminum Alloy

Working Style

High-speed universal

Disc Diameter

8 Inches

Variable Speed

With Variable Speed

Weight

5000kgs

Wokpiece Size

8 Inches 12 Inches

Power(kVA)

18kVA(Three Phase,200V)

Air Pressure

0.5-0.8 Max

Wheel Coolant

0.3-0.4max

Transport Package

Standard Export Wooden Case

Specification

1400x3300x1800

Trademark

OEM

Origin

China

HS Code

8486102000

Production Capacity

500PCS/PC/Year

Key features

Fully Automatic Operation: Equipped with automatic wafer pick, loading/unloading, and size switching without hardware replacement.
Dual Wafer Compatibility: Compatible with 8-inch and 12-inch wafers, realizing automatic size switching.
High Rigidity Spindle: Features high power, low vibration air bearing spindle with variable speed 1000-4000rpm.
Clean Room Robot Arm: Automatic 4-axes wafer pick robot arm designed for clean room environment stability.
User Friendly Interface: 15 inches high sensitivity LCD screen with user-friendly GUI and portable HMI operating handle.
Strong Cleaning Technology: Strong two-fluid cleaning technology for wafer backside ensures high cleanliness.

Company profile

Ninghai County Chalu Jinbaili Daily Necessities Store
High Repeat Buyers ChoiceYears of Export ExperienceFast DeliveryCustomization from Samples
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2016-07-08Nearest Port: Ningbo, ShanghaiAverage Response Time: ≤2.14hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP

About Our Factory & Business Background

AddressNo. 1 Renmin North Road Gongxing Building Chalu Ninghai, Zhejiang China, Ningbo, Zhejiang, China
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsAluminum Foil, Heat Shrinkable Tube, Aluminum Case, Etched Aluminum Foil, Masking Tape, Pet Film, Rubber Seal, Con Paper for Electrolytic Capacitor, Tab Anode Foil, Semi-Conductor Device

Our Industry Experience & Global Business Record

Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

Product Q&A

Q:What wafer sizes are compatible with this grinder?
A:
The machine is compatible with both 8-inch and 12-inch wafers, allowing automatic size switching without hardware replacement.
Q:What are the spindle speed and power specifications?
A:
The spindle has a rotation speed range of 1000-4000rpm with variable speed control, powered by 18kVA (three phase, 200V).
Q:Does the machine include a robot arm for wafer handling?
A:
Yes, it features an automatic 4-axes wafer pick robot arm designed for clean room environments to ensure stability.
Q:What is the machine's footprint and weight?
A:
The dimensions are 1400*3300*1800 mm (W*D*H), and the total weight is 5000 kg.
Q:What cleaning technology is used for the wafer backside?
A:
The machine employs strong two-fluid cleaning technology specifically designed for effective wafer backside cleaning.

Send Inquiry

*To:Ninghai County Chalu Jinbaili Daily Necessities StoreNinghai County Chalu Jinbaili Daily Necessities Store
*Content:
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