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8 Inches Fully Automatic Wafer Grinder Dfg8560
US$180,000.00
1 Piece
Product profile
Customization
AvailableType
Disc GrinderPower Source
ElectricityModel NO.
HG5260Object
Saw BladeApplication
Semi-ConductorDisc(Wheel) Type
Grinding DiscMaterial
Aluminum AlloyWorking Style
High-speed universalDisc Diameter
8 InchesVariable Speed
With Variable SpeedWeight
5000kgsWokpiece Size
8 Inches 12 InchesPower(kVA)
18kVA(Three Phase,200V)Air Pressure
0.5-0.8 MaxWheel Coolant
0.3-0.4maxTransport Package
Standard Export Wooden CaseSpecification
1400x3300x1800Trademark
OEMOrigin
ChinaHS Code
8486102000Production Capacity
500PCS/PC/YearKey features
Fully Automatic Operation: Equipped with automatic wafer pick, loading/unloading, and size switching without hardware replacement.
Dual Wafer Compatibility: Compatible with 8-inch and 12-inch wafers, realizing automatic size switching.
High Rigidity Spindle: Features high power, low vibration air bearing spindle with variable speed 1000-4000rpm.
Clean Room Robot Arm: Automatic 4-axes wafer pick robot arm designed for clean room environment stability.
User Friendly Interface: 15 inches high sensitivity LCD screen with user-friendly GUI and portable HMI operating handle.
Strong Cleaning Technology: Strong two-fluid cleaning technology for wafer backside ensures high cleanliness.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2016-07-08Nearest Port: Ningbo, ShanghaiAverage Response Time: ≤2.14hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CFR, CIF, DDP
About Our Factory & Business Background
AddressNo. 1 Renmin North Road Gongxing Building Chalu Ninghai, Zhejiang China, Ningbo, Zhejiang, China
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsAluminum Foil, Heat Shrinkable Tube, Aluminum Case, Etched Aluminum Foil, Masking Tape, Pet Film, Rubber Seal, Con Paper for Electrolytic Capacitor, Tab Anode Foil, Semi-Conductor Device
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Product Q&A
Q:What wafer sizes are compatible with this grinder?
A:
The machine is compatible with both 8-inch and 12-inch wafers, allowing automatic size switching without hardware replacement.
Q:What are the spindle speed and power specifications?
A:
The spindle has a rotation speed range of 1000-4000rpm with variable speed control, powered by 18kVA (three phase, 200V).
Q:Does the machine include a robot arm for wafer handling?
A:
Yes, it features an automatic 4-axes wafer pick robot arm designed for clean room environments to ensure stability.
Q:What is the machine's footprint and weight?
A:
The dimensions are 1400*3300*1800 mm (W*D*H), and the total weight is 5000 kg.
Q:What cleaning technology is used for the wafer backside?
A:
The machine employs strong two-fluid cleaning technology specifically designed for effective wafer backside cleaning.
Send Inquiry
*To:
Ninghai County Chalu Jinbaili Daily Necessities Store
Ninghai County Chalu Jinbaili Daily Necessities Store*Content:
Supplier replies will be sent to your registered email
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