Electronic PCB Board Assembly Printed Circuit Board PCBA Manufacturer

Name: Electronic PCB Board Assembly Printed Circuit Board PCBA Manufacturer
Brand: Shenzhen New Chip international Ltd
SKU: 1919751061

Guangdong, ChinaShenzhen New Chip international Ltd

US$0.40-10.00

1 Piece

Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

FR-4

Material

Fiberglass Epoxy Resin + Polyimide Resin

Application

Consumer Electronics

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Epoxy Resin

Brand

New Chip

Capacity

1000000

OEM/ODM

Available

Sample

Available

Surface Treatment

OSP, Enig, HASL, AG Immersion

Certificate Gurantee

Yes

Test

100%E-Testing

Min Bonding Pad Diameter

10mil

Min Thickness of Soldermask

10um

Color of Silk-Screen

White, Yellow, Black

Data File Format

Gerber File and Drilling File, Protel Series, ...

Material for PCB

Fr-4, High Tg Fr$, Halogen Free,

Layer Count

1-20 Layers

Shipping

DHL/UPS/FedEx/Air/Sea

Transport Package

Foam Packing

Specification

FR4 1-4 Layers

Trademark

New Chip

Origin

China

HS Code

8534009000

Production Capacity

1000000

Company profile

Importers and ExportersExhibition ExperienceFast DeliveryStandardized quality control

Shenzhen New Chip international Ltd

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.08h

AI-Powered supplier vetting

SummaryThe supplier is a combined company engaged in electronic products, components, communication equipment, computer hardware and software, and integrated-circuit-related activities. It reports broad customization services, ODM availability, and new products within the past year, indicating active R&D and product development. Production-related information includes a factory location, more than 10 production lines, and 6–10 quality-control staff, but there is no valid manufacturing-capacity contract with related subcontractors. The supplier has in-stock capability, accepts multiple quotation and payment terms, and reports one-month lead times in both peak and off-season periods. Overseas support is limited: it has no overseas warehouse, showroom, agent, branch, or stated overseas-service countries. No certifications or customer cases are identified, and the available financial information is insufficient for assessment.

Supplier typeThe supplier is identified as a combined company with a registered and physical office in Shenzhen, while its factory is separately located in Baoan District, Shenzhen. Its stated business scope covers electronic products, electronic components, communication equipment, computer hardware and software, and integrated-circuit-related sales and technical services.

R&D capabilityThe supplier reports that it had new products in the past year, provides ODM services, and supports multiple customization modes. However, it reports no available SDK and only one year of total R&D-engineer experience, so the evidence supports product-development activity but not a uniformly strong innovation profile.

Production capacityThe supplier reports more than 10 production lines, 6–10 quality-control staff, in-stock capability, and one-month average lead times in both peak and off-season. However, it also states that no valid manufacturing-capacity contract exists with related subcontractors, and the assessment procedures have written procedures but no records, creating a documented operational limitation.

Customization capabilityThe supplier explicitly supports customization from samples, customization from designs, full customization, minor customization, and flexible customization. It also reports ODM availability and new products during the past year, directly supporting broad customization capability.