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DIY RGB Removable Transparent Front Side Panel USB3.0 ATX Computer Case
US$38.50-40.00
500 Pieces
Sample price:US$38.50/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyCase Structure
EATXType
TowerMaterial
Steel plateColor
WhiteFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.8mmTransport Package
CartonSpecification
572mm*322mm*575mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
Full View Acrylic Design: Showcase your system behind three gorgeous acrylic panels with a spacious interior.
Advanced Cable Management: Back cable management with a single hidden channel and easy-access hinged door.
Extreme Cooling Support: Supports up to 11x 120mm fans, 5x 140mm fans, or multiple 360mm radiators.
Customizable Fan Mounts: Motherboard tray allows side-mounting up to 4x 120mm fans or a 420mm radiator.
GPU Vertical Installation: Supports vertical installation of graphics cards for enhanced aesthetics and airflow.
E-ATX Compatibility: Compatible with E-ATX mainboards and supports graphics cards up to 400mm in length.
Premium Build Quality: Constructed with 0.8mm steel plate, ensuring durability and high-quality finish.
OEM/ODM Customization: Offers full, minor, and flexible customization options from samples or designs.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does the case support E-ATX motherboards?
A:
Yes, the case structure is EATX and is compatible with E-ATX mainboards.
Q:What cooling options are available?
A:
It supports up to 11x 120mm or 5x 140mm fans, and multiple radiators including 2x 360mm.
Q:Is OEM or ODM service available?
A:
Yes, OEM and ODM services are available, including full, minor, and flexible customization.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Q:What are the payment terms?
A:
Payment terms include T/T and LC.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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