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Mesh Front Panel Optimized Airflow USB3.0 I/O Interface PC Case
US$8.00-16.00
100 Pieces
Sample price:US$15.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
ATXPower Supply
Without Power SupplyModel NO.
Snake 3Case Structure
ATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
<200mmSheet Thickness
0.45mmI/O Interface
USB3.0*1/ USB2.0*2/HD AudioTransport Package
CartonSpecification
492mm*247mm*445mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
Superior Airflow Design: Mesh front panel with 8 fan positions for efficient heat dissipation.
ATX Compatibility: Supports ATX motherboards and includes back cable management.
USB3.0 Interface: Features USB3.0 port plus USB2.0 and HD Audio for connectivity.
Quality Assurance: 100% visual and function inspection before shipment.
OEM/ODM Service: Flexible customization from samples, designs, or full customization.
Professional Manufacturer: Segotep has 15 years experience with advanced testing systems.
Certified Products: Products certified with FCC and CE standards for global use.
Fast Lead Time: Off-season lead time within 15 workdays for quick delivery.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does this case include a power supply?
A:
No, the power supply is not included with the case.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 pieces.
Q:Is customization available for this product?
A:
Yes, we offer OEM and ODM services including customization from samples, designs, and flexible minor customization.
Q:What are the payment terms?
A:
We accept T/T (Telegraphic Transfer) and LC (Letter of Credit) as payment terms.
Q:What is the lead time for production?
A:
The off-season lead time is within 15 workdays, while the peak season lead time is one month.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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