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E-ATX The Max Glass Side Panel 360 Water Cooler on Top Gaming Case
US$17.00-20.00
500 Pieces
Product specifications
Carton
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
Segotep Rambo 360QCase Structure
EATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.7mmTransport Package
545mm*262mm*520mmSpecification
443mm*210mm*465mmTrademark
SegotepOrigin
ChinaHS Code
84733090Key features
E-ATX Compatibility: Compatible with ATX, M-ATX, ITX, and E-ATX motherboards for maximum expandability.
Tempered Glass Side: Features a side tempered glass panel to showcase internal components and RGB lighting.
360mm Liquid Cooling: Supports up to 360mm water coolers on both the front and top mounting positions.
High Airflow Design: Supports multiple 12cm/14cm fans and radiators for optimal thermal performance.
Premium Build Quality: Constructed with 0.7mm thick SPCC steel plate for durability and stability.
Flexible Storage: Supports 2-3 3.5-inch HDDs and up to 3 2.5-inch SSDs for ample data storage.
OEM/ODM Service: Offers full customization, minor customization, and flexible customization options.
Certified Quality: Products certified with FCC and CE standards, ensuring safety and compliance.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are supported?
A:
This case supports E-ATX, ATX, M-ATX, and ITX motherboards.
Q:Does it support liquid cooling?
A:
Yes, it supports 240mm, 280mm, and 360mm water coolers on the front and top panels.
Q:Can I customize the product?
A:
Yes, we offer full customization, minor customization, and flexible customization based on samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What are the payment terms?
A:
We accept T/T and L/C as payment terms.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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