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Eatx Dual-CPU Motherboard Support Tempered Glass Side Panel Gaming Case
Negotiable
500 Pieces
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
Endura1Case Structure
EATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Non Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.7mmTransport Package
505mm*290mm*465mmSpecification
395mm*230mm*455mmTrademark
SegotepOrigin
ChinaHS Code
8473309000Production Capacity
10000Key features
Dual-CPU Support: Compatible with E-ATX mainboards for high-performance dual-CPU configurations.
Tempered Glass Panel: Features a stylish tempered glass side panel for aesthetic visibility.
Extensive Cooling Support: Supports up to 360mm radiators and multiple 12cm/14cm fans for optimal thermal management.
OEM/ODM Customization: Offers full customization, minor customization, and flexible options from samples or designs.
Premium Build Quality: Constructed with 0.7mm steel plate, ensuring durability and stability.
Advanced Connectivity: Equipped with USB3.0 and USB2.0 ports plus HD Audio I/O for versatile connectivity.
High Capacity Storage: Supports up to two 3.5-inch HDDs or one 3.5-inch HDD plus two 2.5-inch SSDs.
Trusted Manufacturer: Backed by 15 years of experience and ISO-certified testing systems.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard formats are supported?
A:
The case supports E-ATX, ATX, M-ATX, and ITX motherboard formats.
Q:Does the case include a power supply?
A:
No, the power supply is not included with the case.
Q:What cooling options are available?
A:
It supports top 12cm/14cm fans (up to 240/280mm coolers), front 12cm/14cm fans, and rear 12cm/14cm fans.
Q:Is OEM or ODM service available?
A:
Yes, OEM and ODM services are available, including full customization, minor customization, and flexible options.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 pieces.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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