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Exported ATX/Micro ATX Support, 360mm Water Cooling, Full Side Transparent Gaming PC Case
US$8.00-23.00
500 Pieces
Product specifications
Carton
Sample price:US$23.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
Segotep Rambo 360DCase Structure
EATXType
TowerMaterial
Steel plateColor
Black or WhiteFront Interface
USB3.0*1+USB2.0*2Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.8mmTransport Package
Carton BoxSpecification
526mm*285mm*516mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
Full Side Transparent Design: Features a full side transparent panel for showcasing internal components and RGB lighting.
360mm Water Cooling Support: Compatible with large 360mm liquid cooling radiators for efficient thermal management.
E-ATX Mainboard Compatibility: Supports E-ATX, ATX, and Micro ATX motherboards for flexible system building.
Premium Steel Construction: Built with 0.8mm thick steel plate for durability and structural stability.
Flexible Customization Options: Offers full, minor, and flexible customization from samples or designs.
Back Cable Management: Designed with back cable management for clean and organized internal wiring.
Multiple Color Choices: Available in Black or White to match various desktop aesthetics.
Robust Connectivity: Front interface includes 1x USB 3.0 and 2x USB 2.0 ports for fast data transfer.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are supported?
A:
The case supports E-ATX, ATX, and Micro ATX motherboards.
Q:Does it support large water cooling radiators?
A:
Yes, it supports up to 360mm water cooling radiators.
Q:Is the case customizable?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:What are the lead times for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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