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Segotep Gaming PC Case for Eatx 360 Water Cooling Type-C USB3.1
Negotiable
50 Pieces
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyCase Structure
EATXType
TowerMaterial
Steel plateColor
Black & WhiteFront Interface
Type-C+USB 3.0*2+USB 2.0*2+HD AudioCable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.7mmTransport Package
CartonSpecification
500mm*240mm*550mmTrademark
SegotepOrigin
ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
High Airflow Design: Optimized steel front panel and room for up to 7 fans or 360mm radiators for maximum cooling.
Vertical GPU Support: Supports front or side vertical GPU installation with a three-slot mount on the PSU shroud.
Easy Cable Management: Back cable management system with a hidden channel and 32mm space for simple routing.
Premium Connectivity: Top I/O panel features USB 3.1 Type-C, 2x USB 3.0, and audio/mic jacks.
Tool-Free Tempered Glass: Showcase components and RGB lighting with a beautiful tool-free tempered glass side panel.
Massive Storage Capacity: Holds multiple drives with 2x combo 2.5/3.5in trays and 3x 2.5in SSD mounts.
E-ATX Compatibility: Compatible with E-ATX mainboards and supports graphics cards up to 400mm in length.
Robust Build Quality: Constructed from 0.7mm steel plate, ensuring durability and high-quality performance.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does this case support vertical GPU installation?
A:
Yes, it supports both front and side vertical GPU installation to keep a longer lifespan for your GPU.
Q:What cooling options are available?
A:
It accommodates up to 7x 120mm fans or multiple radiators, including 2x simultaneous 360mm radiators for extreme cooling.
Q:What connectivity ports are on the top I/O panel?
A:
The top panel includes a USB 3.1 Type-C port, 2x USB 3.0 ports, and a combination audio/microphone jack.
Q:Is cable management easy in this case?
A:
Yes, it features a back cable management system with a single hidden channel and an easy-access hinged door.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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