Segotep New Arrival Gank 360s-Ape Back Plug-in PC Chassis

Name: Segotep New Arrival Gank 360s-Ape Back Plug-in PC Chassis
Brand: Segotep Electronic Technology Co., Ltd.
SKU: 1977628461

Guangdong, ChinaSegotep Electronic Technology Co., Ltd.

US$20.00-45.70

500 Pieces

Product specifications

Carton

Sample price:US$60.00/piece.Request sample

Product profile

Customization

Available

Compatible Mainboard

MicroATX

Power Supply

Without Power Supply

Model NO.

Segotep Gank 360S-APE

Case Structure

MATX

Type

Tower

Material

Steel plate

Color

Black or White

Front Interface

USB3.0

Cable Management

Back Cable Management

Maximum Lenght of Graphics Card

300-400mm

Sheet Thickness

0.8mm

Package Size

504mm*327mm*547mm

Structure Size

440mm*235mm*405mm

Graphics Card Length

390mm(Max)

PSU Length

250mm(Max)

CPU Cooler Height

172mm (Max)

Fan Position Front

12cm*3/14cm*3(Lock on The Outside of The Hardware)

Top

:12*3/14cm*2(Support 360mm/280/240water-Cooling)

PSU Cover

12cm*3

Lnternal Board

12cm*2

Rear

12cm*1

L/O Interface

Type C*1+ USB3.0*1+HD Audio I/0

Pcie Slots

5PCS

Transport Package

Carton

Specification

453mm*235mm*405mm

Trademark

Segotep

Origin

China

HS Code

8473309000

Production Capacity

1000000/Per Year

Company profile

Experienced TeamStandardized quality controlR&D CapabilitiesManagement Certification

Segotep Electronic Technology Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h

AI-Powered supplier vetting

SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.

Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.

After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.

R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.

Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.

Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.