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Segotep Zack ATX Gaming Computer Cases
US$26.50
100-299 Pieces
US$25.80
300-499 Pieces
US$24.10
500-999 Pieces
US$23.50
1,000+ Pieces
Sample price:US$28.50/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
Eatx/ATX/Matx/ItxPower Supply
Without Power SupplyModel NO.
Segotep ZackCase Structure
EATXType
TowerMaterial
Steel plateColor
Silver GrayFront Interface
USB3.0*1+USB2.0*2+Audio I/OCable Management
Back Cable ManagementMaximum Lenght of Graphics Card
≤330mmSheet Thickness
0.6mmTransport Package
CartonSpecification
L430*W218*H480mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
013250Production Capacity
1000000Key features
Wide Motherboard Compatibility: Supports EATX, ATX, M-ATX, and ITX motherboard types.
Tempered Glass Side Panel: Features a glass left side panel for aesthetic display.
Extensive Fan Support: Supports up to 3x12cm or 3x140cm front fans and 2x12cm or 2x14cm top fans.
Radiator Cooling Options: Compatible with 240mm/280mm front radiators, 240mm top radiators, and 120mm rear radiators.
Robust Storage Capacity: Includes 2x3.5 inch HDD bays and 5x2.5 inch SSD bays.
High Expansion Capability: Provides 8 expansion slots for additional hardware.
Advanced Cable Management: Features dedicated back cable management for clean builds.
OEM and ODM Services: Offers full customization, minor customization, and flexible customization options.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard types are supported?
A:
This case supports EATX, ATX, M-ATX, and ITX motherboard types.
Q:Does the case support liquid cooling radiators?
A:
Yes, it supports 240mm/280mm front radiators, 240mm top radiators, and 120mm rear radiators.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 500 pieces.
Q:Are OEM and ODM services available?
A:
Yes, we offer full customization, minor customization, and flexible customization based on samples or designs.
Q:What is the lead time for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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