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Tempered Glass Gaming PC Case Back Cable Management 0.5mm SPCC
US$13.00-15.00
100 Pieces
Sample price:US$13.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
MicroATXPower Supply
Without Power SupplyModel NO.
Segotep Prime HCase Structure
MATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
200-300mmSheet Thickness
0.5mmTransport Package
CartonSpecification
435mm*270mm*385mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearCompany profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a combined factory in Boluo County, Huizhou, operating in manufacturing. It demonstrates broad customization and R&D capabilities, including 3D software design, ODM, SDK availability, new product development, and documented R&D review, verification, and validation records. Production-related evidence includes multiple automated and testing facilities, while quality processes include standardized finished-product inspection, raw-material traceability, complaint handling procedures, and quality assurance. The supplier offers OEM services for well-known brands, but no specific customer names or cases are provided. It has participated in several offline trade shows and supports international quotation and payment terms, although no overseas warehouses, showrooms, agents, or branches are reported. Certification information and financial credibility evidence are not sufficient for assessment.
Supplier typeThe supplier is classified as a combined company and a factory, with its location in Boluo County, Huizhou. Its associated companies are in the manufacturing industry, indicating a manufacturing-oriented supplier structure.
After-Sales capabilityR&D engineers are responsible for technical support during production and after-sales service. The supplier also has a documented customer-complaint procedure with follow-up records, supporting an established after-sales and complaint-handling process.
R&D capabilityThe supplier reports new products within the past year, provides 3D software design, ODM services, and an available SDK. Its engineers handle new product development, and related design input, output, review, verification, and confirmation documents are available for audit, providing direct evidence of structured R&D capability.
Production capacityThe supplier operates as a manufacturing factory and reports automated inspection, screwing, packaging, wave soldering, and burn-in testing facilities. It also uses standardized finished-product inspection instructions, maintains written supplier-service procedures and corrective-action records, and reports lead times of within 15 workdays off-season and one month during peak season.
Customization capabilityThe supplier explicitly supports customization from samples and designs, full, minor, and flexible customization, as well as 3D software design and ODM services. This combination indicates broad product and design adaptation capability.
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*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
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