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USB3.0 Type-C Support Long Graphics Card 240 Water Cooler Mini Itx Case
Negotiable
10 Pieces
Product profile
Customization
AvailableCompatible Mainboard
ITXPower Supply
Without Power SupplyModel NO.
Segotep Slath miniCase Structure
ITXType
TowerMaterial
AluminumColor
SilverFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
200-300mmSheet Thickness
0.8mmTransport Package
CartonSpecification
390mm*340mm*352mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
8473309000Production Capacity
1000000/Per YearKey features
Triple-Sided Tempered Glass: Double curve tempered glass on three sides for clear 360-degree views of internal components.
Vertical VGA Installation: ATX 3.1 structure supports vertical installation of graphics cards up to 200mm in length.
Efficient Heat Dissipation: Designed with considerable heat dissipation systems suitable for high-end gaming setups.
Premium Aluminum Build: Constructed from high-quality aluminum with 0.8mm sheet thickness for durability and style.
USB 3.0 Front Interface: Features convenient USB 3.0 ports on the front panel for fast data transfer and connectivity.
Back Cable Management: Integrated back cable management system ensures a clean and organized interior layout.
OEM/ODM Customization: Offers flexible customization options including samples, designs, and minor adjustments.
SFX Power Supply Support: Compatible with regular SFX power supplies for compact and efficient power delivery.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does this case include a power supply?
A:
No, the power supply is not included. However, it supports regular SFX power supplies for your convenience.
Q:What is the material and color of the case?
A:
The case is made of high-quality aluminum and comes in a sleek silver color with double curve tempered glass.
Q:Can I customize this product with my own design?
A:
Yes, we offer OEM and ODM services, including customization from samples, designs, and flexible minor adjustments.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Q:What are the payment terms?
A:
We accept T/T (Telegraphic Transfer) and LC (Letter of Credit) as terms of payment.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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