Stable Dimension & Consistent Plating Effect
Non-consumable anode structure keeps fixed polar distance. Uniform current distribution guarantees stable metal layer thickness, ideal for HDI boards, IC s
No Sludge, Low Defect Rate
No copper powder or phosphorus residue enters the plating bath. Effectively eliminates pinholes, burrs and void defects on PCB circuits, improving finished product yield.
Compatible with PPR Pulse Reverse Electroplating
Stably withstand frequent positive and negative current switching. Remarkably enhance throwing power for deep hole and blind hole copper electrodeposit
Energy Saving & High Catalytic Activity
Low cell voltage reduces power consumption during continuous metal electrodeposition. Good compatibility with organic plating brighteners.
Long Service Life & Recyclable Titanium Base
Two coating options for different working conditions. After coating aging, intact titanium substrate can be re-polished and re-coated to lower overall proc
Less Downtime & Low Maintenance
No frequent copper ball replenishment, anode bag cleaning and shutdown replacement, greatly improving production line operating rate.