Powered by Made-in-China.com
Fast Processing Precision Wafer Grinding Thinning Machine
US$20,000.00-60,000.00
1 Piece
Sample price:US$10.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
12monthsWarranty
12monthsModel NO.
FD-320AType
Surface Grinding MachineProcessing Object
Flat WorkpiecesAbrasives
Grinding WheelControlling Mode
PLCAutomatic Grade
SemiautomaticCylindrical Grinder Type
Surface Grinding MachinePrecision
High PrecisionCertification
ISO 9001Condition
NewPower Source
ElectricityDisc(Wheel) Type
Grinding DiscVariable Speed
with Variable SpeedApplication
Grinding IndustryMaterial
Metallic and Non-Metallic MaterialsDisc Diameter
320mmService
Oversea Setup & After-Sale AvalaibleClass
ThinnerProcess Station
1Abrasive
Recyclable Water & Grinding WheelWheel Rotate Speed
0-3000 RpmWorkpiece Accuracy Control(Parallelism)
1umPower of Grinding Wheel Motor
5.5kwTransport Package
Wood CrateTrademark
PONDAOrigin
ChinaProduction Capacity
500 Unit/YearKey features
High Efficiency Grinding: LED sapphire grinding speed up to 48 microns/min; Silicon wafers up to 250 microns/min.
Automatic Torque Control: Automatically adjusts speed and compensates wheel wear to prevent workpiece deformation.
CNC Touch Screen Control: Features CNC program control system with intuitive touch screen operation panel.
Wide Material Compatibility: Processes metallic, non-metallic, ceramics, glass, sapphire, plastics, and composites.
Overseas Setup Service: Provides overseas installation setup and online tutorial for after-sale support.
ISO 9001 Certified: Manufactured by a certified National High-Tech Enterprise with ISO 9001 standards.
Free Sample Making: Offers free sample production to confirm production line requirements before order.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤15h
AI-Powered supplier vetting
SummaryThe supplier manufactures grinding equipment, accessories, and consumables, while also providing related sales, technology development, R&D, software, and after-sales services. It has integrated R&D, design, manufacturing, sales, and service capabilities, offers 3D software design and multiple customization modes, and reported new products in the past year. Production includes five lines and 21–30 quality-control staff, with export experience of 18 years and markets across Asia, Europe, Australia, North America, and domestic China. Service procedures and corrective-action mechanisms are documented, but complaint handling lacks written records. No overseas warehouses, showrooms, agents, branches, or offline trade-show participation are reported. Financial records are identified for 2021–2023, but their results are not provided.
Supplier typeThe supplier is a manufacturer and integrated industrial service provider focused on grinding equipment, accessories, consumables, and related software and technical services. Its stated scope includes production, R&D, sales, import/export, and after-sales service.
R&D capabilityThe supplier provides 3D software design, conducts R&D and design, and reports new products within the past year. It also has 10 years of total R&D engineer experience and offers technology development services, supporting a demonstrated innovation capability.
Production capacityThe supplier manufactures its own grinding equipment, accessories, and consumables and operates five production lines with 21–30 quality-control staff. However, it does not continuously reconcile quantities for each batch or mass production, indicating a production-control weakness despite established manufacturing capacity.
Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, minor customization, and flexible customization, and also provides 3D software design services. These capabilities directly support a broad range of customized product requirements.
Product Q&A
Q:Does Ponda charge for making samples?
A:
No, it is free to make samples.
Q:Is Ponda a trader or manufacturer?
A:
We are a manufacturer and a certified National High-Tech Enterprise.
Q:How long does it take for machine delivery?
A:
Approximately 15 days for delivery. If out of stock, an additional 15 days is needed for manufacturing.
Q:Does Ponda provide overseas setup and after-sale service?
A:
Yes, we provide overseas service and online tutorials.
Q:How many types of machines does Ponda manufacture?
A:
We have 21 major series, 5 different types running on different principles, more than 15 types of plates, and 100 types of slurries.
Send Inquiry
*To:
Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Sapphire and Wafer Materials Vertical Precision Thinning and Lapping Machine
US$70,000.00-100,000.00
1 Piece(MOQ)
Kizi Ks700y Surface Fine Grinding Polishing Processing Machine for Wafer Parts
US$80,000.00-100,000.00
1 Piece(MOQ)
High Precision Thinning and Lapping Machine for Silicon Wafers
US$39,999.00-59,999.00
1 Piece(MOQ)
Processing Precision Requires High Speed Silicon Wafer Transverse Thinning Machine
US$20,000.00-60,000.00
1 Piece(MOQ)
for Grinding of Wafers New-Type Ultra-Precision Thinning Machine
US$20,000.00-40,000.00
1 Piece(MOQ)
Wafer and Sapphire Materials Vertical High Precision Thinning and Lapping Machine
US$70,000.00-100,000.00
1 Piece(MOQ)
Semiconductor Silicon Wafer Thinning Machine High Precision
US$6,500.00-7,000.00
1 Piece(MOQ)
Exceptional-Precision Stable Nt-630 CNC Tool Grinding Machine for Mechanical Processing
US$82,000.00-82,800.00
1 Piece(MOQ)
Vertical High-Precision Sapphire Thinning Grinding Machine for Plane Processing
US$20,000.00-60,000.00
1 Piece(MOQ)
Nz-50 Naseiko Step Grinding Machine for Precision Processing 0 05-20mm
US$82,000.00-82,800.00
1 Piece(MOQ)
High Precision Fully Automatic Wafer Thinning Grinding Polishing and Chamfering Machine
US$280,000.00-320,000.00
1 Piece(MOQ)
High Precision Power Assembly for Metal Parts Processing Factory with Adjustable Abrasive Wheel Set Grinding Machine
US$100,000.00-1,000,000.00
1 Set(MOQ)
IC Silicon Wafer Thinning Machine High Precision
US$6,500.00-7,000.00
1 Piece(MOQ)
High Precision Tct Grinding Machine for Industrial Tungsten Carbide Blade Processing
US$13,000.00-15,000.00
1 Set(MOQ)
Precision Fast Response CNC Metal Surface Grinding Machine
US$990.00-8,900.00
1 Piece(MOQ)
3ml4780b-D Vertical Steel Ball Grinding Machine for Precision Processing
US$11,000.00-12,000.00
1 Piece(MOQ)
Factory Price Precision Surface Grinding Machine for Metal Workshop Processing
US$5,500.00-60,000.00
1 Piece(MOQ)















