Powered by Made-in-China.com
Fully Automatic High Precision Thinning Machine for Wafer
US$20,000.00-60,000.00
1 Piece
Sample price:US$10.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
12monthsWarranty
12monthsModel NO.
550AType
Surface Grinding MachineProcessing Object
Flat WorkpiecesAbrasives
Grinding WheelControlling Mode
PLCAutomatic Grade
SemiautomaticCylindrical Grinder Type
Surface Grinding MachinePrecision
High PrecisionCertification
ISO 9001Condition
NewPower Source
ElectricityDisc(Wheel) Type
Grinding DiscVariable Speed
with Variable SpeedApplication
Semiconductor IndustryService
Oversea Setup & After-Sale AvalaibleClass
ThinnerProcess Station
1Abrasive
Recyclable Water & Grinding WheelWheel Rotate Speed
0-3000 RpmWorkpiece Accuracy Control(Parallelism)
1umPower of Grinding Wheel Motor
5.5kwTransport Package
Wood CrateTrademark
PONDAOrigin
ChinaProduction Capacity
500 Unit/YearCompany profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤6.16h
AI-Powered supplier vetting
SummaryThe supplier integrates R&D, design, manufacturing, sales, and after-sales service, producing grinding equipment, accessories, and consumables for optical, electronics, mold, metal, and hardware applications. It reports 3D software design capability, multiple customization modes, and new products developed within the past year. Manufacturing includes five production lines, while quality control staffing is reported at 21–30 personnel. The company has 18 years of export experience, self-operated import/export rights, and markets covering Asia, Europe, Australia, North America, and domestic customers. Service procedures and corrective/preventive-action records exist, but complaint handling lacks written records. No overseas warehouse, showroom, agent/branch, or offline trade-show participation is reported. Financial records are identified for 2021–2023, but their results are not provided. Customer-specific cases and certifications are not evidenced.
Supplier typeThe supplier is a manufacturer and integrated industrial service provider: its stated scope includes production, sales, technology development, R&D, software services, import/export, and after-sales-related functions. Its products focus on grinding equipment, accessories, consumables, and applications across optical, electronics, molds, metal parts, and hardware.
R&D capabilityThe supplier reports integrated R&D and design functions, 3D software design services, ten years of total R&D engineer experience, and new product development during the past year. These details support an active product-development capability.
Production capacityThe supplier manufactures grinding equipment, accessories, and consumables and operates five production lines. It reports 21–30 quality-control staff, but does not continuously reconcile quantities for each batch or production volume, indicating a documented manufacturing-control weakness.
Customization capabilityThe supplier explicitly offers customization from samples and designs, full, minor, and flexible customization, together with 3D software design services. This demonstrates broad stated customization coverage.
Send Inquiry
*To:
Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Customizable Three-Station Fully Automatic High Precision Thinning Machine
US$155,840.00-183,774.00
1 Piece(MOQ)
Fully Automatic Wafer Thinning Machine for Grinding 3-12 Inch Wafers
US$155,840.00-183,774.00
1 Piece(MOQ)
Advanced Fully Automatic CNC Spline Grinding Machine for Precision Engineering
US$120,000.00-200,000.00
1 Piece(MOQ)
Semi-Automatic Horizontal High Speed Precision Thinning and Lapping Machine for Sapphire
US$29,500.00
1 Piece(MOQ)
Stability Fully Automatic CNC Precision Grinding Machine for Mold Manufacturing
US$2,380.00-2,500.00
1 Piece(MOQ)
Semi Automatic Precision Lapping Polishing Finishing Machine for Wafers
US$80,000.00-100,000.00
1 Piece(MOQ)
High Precision Automatic CNC Grinding Machine for Production Workshop
US$2,380.00-2,500.00
1 Piece(MOQ)
High Flexibility Fully Automatic CNC Grinding Machine for Foundry
US$163,800.00
1 Piece(MOQ)
High Effective Fully Automatic Precision Wafer Grinding Polisher Machine
US$155,840.00-183,774.00
1 Piece(MOQ)
Fully Automatic High Flexibility CNC Casting Grinding Machine for Iron Casting Foundry
US$163,800.00
1 Piece(MOQ)
Ceramic Chips High Speed Fully Automatic Thinning Machine
US$155,840.00-183,774.00
1 Piece(MOQ)
Xieli Machinery Fully Automatic Small Centerless Grinder for Precision Grinding of Metal Bars
US$6,500.00-7,000.00
1 set(MOQ)
Stability Fully Automatic Precision CNC Grinding Machine for Machining
US$2,380.00-2,500.00
1 Piece(MOQ)
Automatic Tool Setting High Precision Thinning and Lapping Machine for Zirconia Ceramics
US$60,000.00-80,000.00
1 Piece(MOQ)
High Precision Automatic CNC Grinding Machine for Mold Processing
US$2,380.00-2,500.00
1 Piece(MOQ)
High Precision Valves Surface Lapping and Thinning Machine for Sapphire Glass Ceramic
US$90,000.00-110,000.00
1 Piece(MOQ)
IC Silicon Wafer Thinning Machine High Precision
US$6,500.00-7,000.00
1 Piece(MOQ)
Long Service Life CNC Automatic High Precision Metal Hydraulic Vertical Surface Grinding Machine with PLC and Motor
US$6,900.00-16,800.00
1 Piece(MOQ)
Silicon Wafer Thinning Machine for Microelectronics
US$6,500.00-7,000.00
1 Piece(MOQ)
High Precision Industrial High Speed Durable Fully Automatic Circular Knife Sharpening Machine
US$680.00-700.00
1 Set(MOQ)

















