High-Speed Universal Grinding: Variable speed up to 3000 RPM for efficient wafer edge chamfering.
Dual Worktable Design: Features 2 worktables with 0-400 RPM rotation for continuous processing.
Versatile Material Compatibility: Processes metal, non-metal, sapphire, SiC, ceramics, and glass wafers.
ISO Certified Quality: Manufactured by a certified National High-Tech Enterprise with ISO standards.
Comprehensive Warranty: Includes 12-month warranty covering mechanical defects and parts.
Flexible Customization: Supports customization from samples, designs, and minor adjustments.
Global After-Sales Support: Provides overseas setup, online tutorials, and 12-month service.