High Precision Fully Automatic Thinning and Lapping Machine for Silicon Wafers

Name: High Precision Fully Automatic Thinning and Lapping Machine for Silicon Wafers
Brand: Shenzhen Ponda Grinding Technology Co.,Ltd.
SKU: 2319216525

Guangdong, ChinaShenzhen Ponda Grinding Technology Co.,Ltd.

US$155,840.00-183,774.00

1 Piece

Sample price:US$5.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

12months

Warranty

12months

Model NO.

PDG 2300 AT

Type

Surface Grinding Machine

Processing Object

Flat Workpieces

Abrasives

Grinding Wheel

Controlling Mode

PLC

Automatic Grade

Semiautomatic

Cylindrical Grinder Type

Surface Grinding Machine

Precision

High Precision

Certification

ISO 9001

Condition

New

Power Source

Electricity

Working Style

High-Speed Universal

Variable Speed

with Variable Speed

Object

Wafer

Application

Electronic Technique

Disc(Wheel) Type

Thinning Machine

Transport Package

Ponda

Trademark

PONDA

Origin

China

Production Capacity

500 Unit/Year

Company profile

Cooperated with Fortune 500Years of Export ExperienceExperienced TeamR&D Capabilities

Shenzhen Ponda Grinding Technology Co.,Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤15h

AI-Powered supplier vetting

SummaryThe supplier manufactures grinding equipment, accessories, and consumables, while also providing related sales, technology development, R&D, software, and after-sales services. It has integrated R&D, design, manufacturing, sales, and service capabilities, offers 3D software design and multiple customization modes, and reported new products in the past year. Production includes five lines and 21–30 quality-control staff, with export experience of 18 years and markets across Asia, Europe, Australia, North America, and domestic China. Service procedures and corrective-action mechanisms are documented, but complaint handling lacks written records. No overseas warehouses, showrooms, agents, branches, or offline trade-show participation are reported. Financial records are identified for 2021–2023, but their results are not provided.

Supplier typeThe supplier is a manufacturer and integrated industrial service provider focused on grinding equipment, accessories, consumables, and related software and technical services. Its stated scope includes production, R&D, sales, import/export, and after-sales service.

R&D capabilityThe supplier provides 3D software design, conducts R&D and design, and reports new products within the past year. It also has 10 years of total R&D engineer experience and offers technology development services, supporting a demonstrated innovation capability.

Production capacityThe supplier manufactures its own grinding equipment, accessories, and consumables and operates five production lines with 21–30 quality-control staff. However, it does not continuously reconcile quantities for each batch or mass production, indicating a production-control weakness despite established manufacturing capacity.

Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, minor customization, and flexible customization, and also provides 3D software design services. These capabilities directly support a broad range of customized product requirements.