Powered by Made-in-China.com
It Adopts PLC+ Touch Screen Semi-Automatic Wafer Thinning Machine
US$30,000.00-50,000.00
1 Piece
Sample price:US$5.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
12monthsWarranty
12monthsModel NO.
300Type
Surface Grinding MachineProcessing Object
Flat WorkpiecesAbrasives
Grinding WheelControlling Mode
PLCAutomatic Grade
SemiautomaticCylindrical Grinder Type
Surface Grinding MachinePrecision
High PrecisionCertification
ISO 9001Condition
NewPower Source
ElectricityWorking Style
High-Speed UniversalVariable Speed
with Variable SpeedObject
WaferApplication
Electronic TechniqueDisc(Wheel) Type
Thinning MachineTransport Package
PondaTrademark
PONDAOrigin
ChinaProduction Capacity
500 Unit/YearCompany profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤3.76h
AI-Powered supplier vetting
SummaryThe supplier is an integrated company offering R&D, design, manufacturing, sales, and after-sales services, with a focus on grinding equipment and related services. They have a strong emphasis on customization and innovation, supported by a capable R&D team. While they do not have overseas warehouses or showrooms, they have a moderate export presence and a structured approach to service capability and customer complaints. Financial data indicates stability, though specific certifications are not noted in the available information.
Supplier typeThe supplier is involved in R&D, design, manufacturing, and sales, focusing on grinding equipment and related services, indicating a comprehensive service scope.
After-Sales capabilityThe company offers robust after-sales support with clear written procedures for service capability, though lacks written records for handling customer complaints.
R&D capabilityThe supplier demonstrates strong innovation capability with ongoing R&D efforts and new product development over the past year.
Production capacityThe supplier operates 5 production lines with an annual output of US$5-10 million, supported by a sizable quality control staff.
Customization capabilityThe supplier offers extensive customization options, including full and minor modifications, from samples and designs.
Send Inquiry
*To:
Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Fully Automatic Wafer Thinning Machine with LCD Touch Screen User Interface
US$155,840.00-183,774.00
1 Piece(MOQ)
Grind Wafers From 3 to 12 Inches Semi-Automatic Wafer Thinning Machine
US$30,000.00-50,000.00
1 Piece(MOQ)
Touch Screen Siemens Brand Surface Grinding Machine
US$14,000.00-16,000.00
1 Piece(MOQ)
Shenzhen Ponda Two-Axis Semi-Automatic Wafer Thinning Machine
US$247,776.00-309,720.00
1 Piece(MOQ)
Ponda High-Persion Semi-Automatic Wafer Thinning Machine
US$30,000.00-50,000.00
1 Piece(MOQ)
250*500mm Sg2550SD High Precision Hydraulic Automatic Surface Grinding Machine Grinder Machine
US$10,000.00-30,000.00
1 set(MOQ)
Automatic Blade Sharpener CNC Saw Blade Grinding Machine
US$2,100.00-7,500.00
1 Piece(MOQ)
Silicon Wafer Thinning Machine for Semiconductor Industry
US$6,500.00-7,000.00
1 Piece(MOQ)
Automatic Blade Sharpener Circular Saw Blade Grinding Sharpening Machine
US$2,100.00-7,500.00
1 Piece(MOQ)
Automatic Carbide Woodworking Circular Saw Blade Sharpener Grinding Machine
US$800.00-7,500.00
1 Piece(MOQ)
Sg2550SD Saddle Moving Hydraulic Precision Automatic Surface Grinder Surface Grinding Machine
US$10,000.00-30,000.00
1 set(MOQ)
Automatic CNC Circular Saw Blade Grinding Knife Grinder Machine
US$800.00-7,500.00
1 Piece(MOQ)
Silian Semi-Automatic Micro-Fine Powder Pulverizer Mill Machine for Herb Food Powder Cosmetics
US$13,860.00-15,015.00
1 sets(MOQ)
Silicon Wafer Thinning Machine for Microelectronics
US$6,500.00-7,000.00
1 Piece(MOQ)
Semiconductor Silicon Wafer Thinning Machine High Precision
US$6,500.00-7,000.00
1 Piece(MOQ)
Servo Driving Full Touch Screen CNC Punching Press Tool Grinding Machine
US$8,000.00-8,500.00
1 Piece(MOQ)
Semiconductor Wafer Processing Automatic Surface Grinder Machine
US$10,000.00-30,000.00
1 set(MOQ)
Semi-automatic Knife Grinding Straight Blade Sharpening Machine / Knife Grinder
US$1,700.00-1,800.00
1 Set(MOQ)
250*500mm High Precision Hydraulic Semi Automatic Surface Grinding Grinder Machine
US$10,000.00-30,000.00
1 set(MOQ)















