0.8mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging

Name: 0.8mil Copper Bonding Wire for Microelectronics, LED Packaging, IC Packaging
Brand: Shenzhen Silver Technologies Ltd
SKU: 2041914605

Guangdong, ChinaShenzhen Silver Technologies Ltd

US$60.00

10 g

Product profile

Customization

Available

Type

Bare

Conductor Type

Alloy

Model NO.

0.8mil

Application

Microelectronics, LED Packaging, IC Packaging

Conductor Material

Copper

Material Shape

Round Wire

Range of Application

Microelectronics, LED Packaging, IC Packaging

Certification

ISO9001, CE, CCC, RoHS

Length

500m or 1000m

Wire Diameter

0.7-3.0mil

Transport Package

Bubble Chamber, Paper Box

Origin

China

Production Capacity

100000

Company profile

Shenzhen Silver Technologies Ltd

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2023-01-03Nearest Port: shenzhenAverage Response Time: ≤6.70hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB

About Our Factory & Business Background

AddressNo. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsAlloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire