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New Type Inner Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
US$35.00
20 g
Product profile
Customization
AvailableType
BareMaterial Shape
Round WireCertification
ISO9001, CE, CCC, RoHSLength
500m or 1000mWire Diameter
0.7-3.0milMaterial
Au, AG, Pd, CuContent
CustomizedTransport Package
Bubble Chamber, Paper BoxOrigin
ChinaProduction Capacity
100000Company profile
Business Type: Manufacturer/FactoryExport Year: 2023-01-03Nearest Port: shenzhenAverage Response Time: ≤6.70hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB
About Our Factory & Business Background
AddressNo. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsAlloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:Shenzhen Silver Technologies Ltd
Shenzhen Silver Technologies Ltd*Content:
Supplier replies will be sent to your registered email
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