Ceb-8PE4 ATX COM-Express Baseboard Winbond W83627 Industrial Motherboard for Commell

Name: Ceb-8PE4 ATX COM-Express Baseboard Winbond W83627 Industrial Motherboard for Commell
Brand: Beijing Teket Innovation Technology Company Limited
SKU: 2077599872

Beijing, ChinaBeijing Teket Innovation Technology Company Limited

US$130.00-230.00

1 Piece

Sample price:US$150.00/piece.Request sample

Product profile

Customization

Available

Integrated Graphics

Main Chipset

Intel

Model NO.

CEB-8PE4

Maximum Memory Capacity

Structure

ATX

Memory

DDR3

SATA Interface

SATA3.0

Printed Circuit Board

Double Layers

Main Board Structure

Integrated

Audio Effects

Not HiFi

with CPU

Yes

Socket Type

Onboard CPU

Chipset

Winbond W83627

Products Statys

New

Memory Bank

4xddr3DIMM

CPU Type

Intel

Package

Yes

Launch Date

2019

Memory Type

Qpi 8.0gt/S

Transport Package

Yes

Specification

190mm x 305mm

Trademark

COMMELL

Origin

Bj. Cn

Production Capacity

1000pieces Per Year

Company profile

Beijing Teket Innovation Technology Company Limited

Beijing, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 20 Years CertifiedNearest Port: Beijing Port, Tianjin PortAverage Response Time: ≤8.59h

AI-Powered supplier vetting

SummaryThe supplier specializes in customization services with strong R&D capabilities, offering ODM services and having released new products in the past year. Despite a comprehensive service capability, it lacks overseas infrastructure like warehouses and showrooms, and has limited export experience with only seven staff. Quality control and complaint handling processes are robust, but the supplier does not participate in offline trade shows. Financial data is provided for the last three years, but no specific certifications are mentioned.

After-Sales capabilityThe supplier has clear procedures for handling customer complaints and service capability assessment.

Financial creditFinancial data is available for the past three years, indicating transparency in financial reporting.

R&D capabilityThe supplier has recently developed new products and offers ODM services but lacks an SDK.

Customization capabilityThe supplier offers extensive customization options from samples, designs, and full customization.