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for Sale: Alternative Refurbished Disco Cutting Silicon Wafer Diamond Blades
US$500.00-5,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
One Year Free WarrantyWarranty
One Year Free WarrantyModel NO.
ZH05Usage
Cutting Semiconductor WafersKeyword1
Electroformed Bonded Shaft BladeKeyword2
Semiconductor Wafer Cutting BladeKeyword3
Electroplated Diamond BladeKeyword4
Semiconductor Cutting BladeTransport Package
Wooden Case Packing, Sea and Air Freight Are AvailTrademark
Taiyuan Machinery (Dongguan) Co., LtdOrigin
Dongguan City, Guangdong Province, ChinaProduction Capacity
500PCS/MonthKey features
High-Precision Concentration Control: Five concentration levels available to balance quality and lifespan for various semiconductor wafers.
Minimal Chipping & Narrow Grooves: Ultra-fine diamond micropowder and electro-deposition process ensure high precision and minimal backside chipping.
Reduced Precut Shortening: Advanced technology effectively reduces precut shortening and chip breakage during dicing processes.
One Year Free Warranty: Comprehensive one-year free warranty coverage for after-sales service and product reliability.
Customizable Blade Specifications: Options for '-K specification' to eliminate circumferential patterns and full customization from samples or designs.
Versatile Material Compatibility: Suitable for Silicon wafers, compound semiconductors (GaAs, GaP), and oxide wafers (LiTaO3).
Stable Processing Results: Precise control of diamond abrasive grain concentration stabilizes wear and quality in dicing operations.
Wide Model Range Available: Extensive lineup of DISCO ZHZZ series blades and spare parts for various equipment needs.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen Port, Guangzhou PortAverage Response Time: ≤3.13h
About Our Factory & Business Background
Address103 Room, No. 28 Huancheng Dong Road, Dongcheng Street, Dongguan, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 1-3 months Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners15
Our Production Capability & Technical Expertise
Main ProductsThe Experiment Machine, Mixing Equipment, Double Column Hydraulic Press, Centrifugal Pump, Video Measuring System, Hardness Tester
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2020-07-02
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Repeat Buyers Choice80%~100%
Number of Foreign Trading Staff2
Overseas Agent/BranchYes
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for these blades?
A:
We provide a one-year free warranty for all our refurbished and alternative diamond blades.
Q:Can the blade concentration be customized?
A:
Yes, we offer five specific concentration levels to meet different requirements for quality and lifespan.
Q:What types of wafers can these blades cut?
A:
They are suitable for silicon wafers, compound semiconductor wafers (like GaAs, GaP), and oxide wafers (like LiTaO3).
Q:Is there an option to remove the circumferential pattern on the blade?
A:
Yes, you can choose the '-K specification' which ensures a more uniform blade side surface without the pattern.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Taiyuan Machinery Euqipment(Dongguan) Co., Ltd
Taiyuan Machinery Euqipment(Dongguan) Co., Ltd*Content:
Supplier replies will be sent to your registered email
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