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for Sale: Refurbished and Repaired Disco High-Performance Diamond Dicing Blades, Specifically for Silicon Wafer Cutting
US$500.00-5,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
One Year Free WarrantyWarranty
One Year Free WarrantyModel NO.
ZHDGUsage
Cutting Semiconductor WafersKeyword1
Semiconductor Cutting BladeKeyword2
Semiconductor Wafer Cutting BladeKeyword3
Diamond Hard KnifeKeyword4
Metal Binder BladeTransport Package
Wooden Case Packing, Sea and Air Freight Are AvailTrademark
Taiyuan Machinery (Dongguan) Co., LtdOrigin
Dongguan City, Guangdong Province, ChinaProduction Capacity
500PCS/MonthKey features
One Year Free Warranty: Includes one year of free warranty coverage for refurbished and repaired blades.
High-Precision Cutting: Features narrow cutting grooves, high precision, and minimal chipping for semiconductor wafers.
Wide Concentration Range: Offers various particle sizes and concentrations to meet different cutting needs.
Reduced Burrs: Lower concentrations help reduce resin and metal burrs during processing.
Aluminum Base Design: More practical than non-hub type blades due to the aluminum base structure.
OEM Service Available: Full customization, minor customization, and flexible customization options available.
Versatile Applications: Suitable for cutting chip LED substrates, semiconductor packages, and resin substrates.
Refurbished Quality: High-performance diamond dicing blades refurbished and repaired for silicon wafer cutting.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen Port, Guangzhou PortAverage Response Time: ≤3.13h
About Our Factory & Business Background
Address103 Room, No. 28 Huancheng Dong Road, Dongcheng Street, Dongguan, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 1-3 months Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners15
Our Production Capability & Technical Expertise
Main ProductsThe Experiment Machine, Mixing Equipment, Double Column Hydraulic Press, Centrifugal Pump, Video Measuring System, Hardness Tester
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2020-07-02
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Repeat Buyers Choice80%~100%
Number of Foreign Trading Staff2
Overseas Agent/BranchYes
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for these blades?
A:
We provide a one-year free warranty for all refurbished and repaired Disco high-performance diamond dicing blades.
Q:What materials can these blades cut?
A:
They are specifically designed for cutting silicon wafers, chip LED substrates, various semiconductor packages, and resin substrates with electrodes.
Q:Can I customize the blade specifications?
A:
Yes, we offer full customization, minor customization, and flexible customization options based on samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the available payment terms?
A:
We accept LC, T/T, D/P, PayPal, Western Union, and small-amount payments.
Send Inquiry
*To:
Taiyuan Machinery Euqipment(Dongguan) Co., Ltd
Taiyuan Machinery Euqipment(Dongguan) Co., Ltd*Content:
Supplier replies will be sent to your registered email
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