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Spot Supply Refurbished Disco Nbc-Z Electroplated Bonding Blades
US$500.00-5,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

One Year Free Warranty

Warranty

One Year Free Warranty

Model NO.

NBC-Z

Usage

Cutting Semiconductor Wafers

Keyword4

Nbc-Z Electroformed Bonding Blade

Keyword1

Disco Metal Bonded Blade

Keyword2

Disco Semiconductor Cutting Knife

Keyword3

Shaftless Wafer Cutting Knife

Transport Package

Wooden Case Packing, Sea and Air Freight Are Avail

Trademark

Taiyuan Machinery (Dongguan) Co., Ltd

Origin

Dongguan City, Guangdong Province, China

Production Capacity

500PCS/Month

Key features

Superior Dicing Performance: Realizes superb cutting quality and blade life for wafer dicing and substrate processing.
Ultra-Thin Blade Design: Blade thickness ranges from 0.015 mm to 0.3 mm for deep cutting and grooving.
Wide Application Scope: Suitable for Silicon wafers, Compound semiconductor wafers, and various semiconductor packages.
High Precision Cutting: Made with ultra-fine diamond micropowder featuring narrow grooves and minimal chipping.
Flexible Grit and Bond Options: Wide range of grit sizes and bond types available to meet specific application requirements.
One Year Free Warranty: Includes one year of free warranty coverage for after-sales service.
Compatible with Multiple Machines: Available for use with both dicing saws and slicers.
Refurbished Quality Supply: Spot supply of refurbished DISCO NBC-Z electroplated bonding blades.

Company profile

Taiyuan Machinery Euqipment(Dongguan) Co., Ltd
High Repeat Buyers ChoiceExhibition ExperienceOverseas Agent/BranchOverseas Services
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 Years CertifiedNearest Port: Shenzhen Port, Guangzhou PortAverage Response Time: ≤1.96h

AI-Powered supplier vetting

SummaryThe supplier is a trading company with significant export experience, specializing in a wide range of products including automation machinery and chemical equipment. They have OEM capabilities for popular brands and exhibit a strong customization capability. However, they lack structured after-sales service and quality control processes. They hold ISO and CE certifications and have a notable presence in international markets, despite limited R&D resources.
CertificationsThe supplier holds ISO and CE European certifications, as well as a Manufacture License for pressure machines.
After-Sales capabilityThe supplier lacks documented procedures for handling customer complaints and for service capability assessment, indicating weak after-sales service capability.
R&D capabilityThe supplier lacks SDK availability and has only one R&D engineer, suggesting limited innovation capacity.
Production capacityWith over 30 years of experience in various equipment production and significant export activity, the supplier demonstrates strong production capabilities.
Customization capabilityThe supplier offers extensive customization options, from full to minor customization, indicating strong customization capabilities.
Client casesThe supplier has a substantial international market presence, with significant sales in the USA, South America, and Europe.

Product Q&A

Q:What is the warranty period for these blades?
A:
We provide a one-year free warranty for after-sales service.
Q:What materials can these blades cut?
A:
They are suitable for Silicon wafers, Compound semiconductor wafers (GaAs, GaP, etc.), and various semiconductor packages.
Q:What is the thickness range of the blades?
A:
The blade thickness ranges from 0.015 mm to 0.3 mm.
Q:Are these blades compatible with different machines?
A:
Yes, they are available for both dicing saws and slicers.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.

Send Inquiry

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