Solder ball
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Sn3.0AG0.5cu BGA Solder Ball/Anode for Welding Materials
Sn63pb37 Welding Accessories High Quality Leaded Solder Balls
Sn-0.3AG-0.7cu Lead Free Solder Ball for Welding Material
BGA Solder Balls Welding Balls for Welder Welding Machine From Zhongshi Solder
Tin Implanted Solder Ball Semiconductor High Temperature Welding 0.55mm Tin Grain Tin Ball
Gold-Tin Au80sn20 Golden Tin Ball High Temperature Lead-Free Solder Balls
High Lead Sn10pb90 Solder Ball BGA Planting Ball High Temperature
Soldered at High Temperature with Lead Solder Ball Sn10pb88AG2 Tin Particles0.2mm0.3mm0.4mm0.5mm0.6mm0.76mm
Low Temperature Lead-Free Tin Indium Solder Ball Sn42in58 Melting Point
Low Temperature Lead-Free Solder Ball Sn42bi57.6AG0.4 Tin Block Tin Planting 0.3mm
BGA Soldering Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.3mm
Sn96.5AG3cu0.5 Repair BGA Ball Welding Lead-Free Solder Ball Diameter 0.65mm
High Temperature Lead-Free Solder Ball Tin Particles Sn96.5AG3cu0.5 BGA 0.6mm0.76mm
BGA Ball Planting Repair Welding Sn63pb37 Lead Solder Diameter 0.889mm Tin Particles
Mobile Phone Repair BGA Welding Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.4mm
Lead Sn63pb37 Solder Ball BGA Semiconductor Package 0.76mm
Tin-Lead Solder Ball Mobile Phone Ball Planting Repair BGA
Aging Resistant Au78Sn22 Solder Ball for Industrial Control Chip Packaging
Ultra-Fine Solder Balls for Micro Electronics and PCB Assembly
High Reliability Au78Sn22 Solder Ball for Aerospace Electronic Packaging
High Precision Solder Balls SnPb for BGA and Csp Packaging
High Roundness Au80Sn20 Solder Ball for Flip Chip Packaging
Low Void Au78Sn22 Solder Ball for Third-Generation Semiconductor Sic Packaging
Sourcing guidance for Solder Ball
What are the key technical specifications to consider when selecting solder balls for BGA packaging?
When sourcing solder balls, the alloy composition is the most critical factor. You must choose between Lead-Free (SnAgCu - SAC305/SAC405) for RoHS compliance or Leaded (Sn63Pb37) for specific aerospace/military applications. Additionally, sphericity and diameter tolerance (typically within ±0.01mm) are vital to ensure uniform coplanarity during the reflow process. High-quality balls should have a smooth, bright surface free of oxidation to ensure optimal wetting.
How do I determine the appropriate size and grade for my application?
Solder balls are categorized by diameter, ranging from 0.05mm to 0.76mm. For high-density Flip Chip or CSP (Chip Scale Packaging), smaller diameters are required. You should also verify the Alpha-particle emission rate (Low Alpha or Ultra-Low Alpha) if the product is intended for high-reliability memory chips or processors to prevent Soft Errors caused by radiation.
What compliance standards must solder balls meet for international trade?
Suppliers must provide RoHS (Restriction of Hazardous Substances) and REACH certification for lead-free products. For electronic grade materials, adherence to IPC-7095 (Design and Assembly Process Implementation for BGA) and J-STD-006 (Requirements for Electronic Grade Solder Alloys) is essential to guarantee chemical purity and performance consistency.
How can I evaluate the storage and shelf-life requirements of solder balls?
Solder balls are highly sensitive to oxidation and humidity. Ensure the supplier uses vacuum-sealed packaging with nitrogen flushing and includes desiccant packs. The typical shelf life is 6 to 12 months when stored in a temperature-controlled environment (20-25°C) with humidity below 60% RH. Always check the production date before finalizing a bulk purchase.
Cross-Border Procurement Risks and Strategies for Solder Balls
What are the primary risks when importing solder balls from overseas suppliers?
The biggest risk is oxidation during transit, which can lead to poor soldering joints and high defect rates. To mitigate this, specify hermetic packaging requirements in your contract. Another risk is alloy purity fraud; always request a COA (Certificate of Analysis) for every batch and consider using third-party lab testing to verify the silver (Ag) content in SAC alloys, as this significantly impacts the price.
How should I negotiate pricing and MOQs with specialized chemical/metal suppliers?
Solder ball pricing is heavily tied to London Metal Exchange (LME) daily rates for Tin (Sn) and Silver (Ag). Negotiate a formula-based pricing model rather than a fixed price for long-term contracts. For MOQs, many top-tier manufacturers on Made-in-China.com offer sample jars (e.g., 250k to 500k balls per jar) to allow for technical validation before committing to high-volume industrial quantities.
What are the best practices for shipping and logistics for these precision components?
Solder balls are heavy but fragile in terms of surface integrity. Use express air freight (DHL/FedEx/UPS) for small to medium batches to minimize time in uncontrolled environments. Ensure the outer cartons are double-walled and shock-resistant to prevent the balls from deforming or rubbing against each other, which can create metallic dust and affect placement accuracy.
How can I ensure transaction security and supplier reliability?
Prioritize Audited Suppliers on Made-in-China.com who have undergone on-site factory inspections. Use Secured Payment services to ensure funds are only released upon proof of shipment. For first-time orders, it is highly recommended to hire a third-party inspector to perform a Pre-Shipment Inspection (PSI) to check the vacuum seal integrity and quantity accuracy.

























