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IC Silicon Wafer Double Side Grinding Machine for Thickness Control
US$7,000.00
2 Pieces
US$6,500.00
3+ Pieces

Product profile

Customization

Available

Warranty

1-Year Warranty

Type

Double Side Lapping Machine

Model NO.

BW

Voltage

380 V

CNC or Not

CNC

Core Components

PLC

Machinery Test Report

Provided

Video Outgoing-Inspection

Provided

Power (Kw)

5.5

Weight (Kg)

1800

Machining Accuracy

High Precision

Applicable Industries

Grinding Industry

Installation Method

Floor-Standing

Grinding Wheel Speed

3000(Rpm)

Specification

1700*1300*2170(mm)

Trademark

BW

Origin

Jiangsu, China

Key features

Integrated Grinding Process: Achieves integrated rough and fine grinding for complete silicon wafer production lines.
High Precision Control: Utilizes PLC, grating ruler, and servo control for fully closed-loop thickness management.
Stable Operation: Designed with high processing precision and stable performance for continuous use.
Dual Spindle Functionality: Lower spindle switches between rough and fine grinding positions automatically.
1-Year Warranty: Comprehensive warranty coverage provided for all mechanical equipment.
CNC Technology: Advanced CNC system ensures accurate and efficient machining operations.
Quality Inspection Reports: Machinery test reports and video outgoing inspections are provided for verification.
Floor-Standing Design: Compact floor-standing installation method suitable for grinding industry applications.

Company profile

Nanjing New Donor Machinery Equipment Co., Ltd.
High Repeat Buyers ChoiceLow MOQFlexible Customization
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 2 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤5.21h

AI-Powered supplier vetting

SummaryNanjing New Donor Machinery Equipment Co., Ltd., based in Jiangsu, China, is a manufacturer specializing in heat exchangers and related products. The company operates as a limited entity and is part of a larger company group. It provides OEM services for well-known brands but lacks SDK availability for R&D. The supplier exports a significant portion of its sales, mainly through agents. While it emphasizes quality and innovation, specific certifications are not detailed. It has a modern quality management system and offers versatile customization services.
Supplier typeThe supplier is a manufacturer/factory, operating as a limited company in Jiangsu, China, and is part of a larger company group.
Financial creditThe supplier's financial information is available for the last three years, indicating a stable financial capacity.
Production capacityThe supplier has advanced production equipment and a high-standard quality control system, suggesting strong production capabilities.
Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.
Client casesThe supplier has a good reputation among domestic and international customers, implying successful customer cases.

Product Q&A

Q:What is the warranty period for this machine?
A:
We provide a 1-year warranty for this equipment.
Q:Does the machine support CNC control?
A:
Yes, this machine is equipped with CNC technology for precise operation.
Q:What is the maximum grinding wheel speed?
A:
The grinding wheel speed reaches up to 3000 RPM.
Q:Is the machine suitable for silicon wafer production lines?
A:
Yes, it can build a complete silicon wafer production line with integrated grinding capabilities.
Q:What is the lead time for delivery?
A:
Lead time varies by season: 1-3 months during off-peak season and 3-6 months during peak season.

Send Inquiry

*To:Nanjing New Donor Machinery Equipment Co., Ltd.Nanjing New Donor Machinery Equipment Co., Ltd.
*Content:
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