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Semiconductor Silicon Wafer Double Side Grinding Machine CNC
US$7,000.00
2 Pieces
US$6,500.00
3+ Pieces

Product profile

Customization

Available

Warranty

1-Year Warranty

Type

Double Side Lapping Machine

Model NO.

BW

Voltage

380 V

CNC or Not

CNC

Core Components

PLC

Machinery Test Report

Provided

Video Outgoing-Inspection

Provided

Power (Kw)

5.5

Weight (Kg)

1800

Machining Accuracy

High Precision

Applicable Industries

Grinding Industry

Installation Method

Floor-Standing

Grinding Wheel Speed

3000(Rpm)

Specification

1700*1300*2170(mm)

Trademark

BW

Origin

Jiangsu, China

Key features

Integrated Grinding Process: Thinning machine achieves integrated rough and fine grinding for complete silicon wafer production lines.
High Precision Control: Adopts PLC, grating ruler, and servo control for fully closed-loop thickness control with high precision.
Stable Operation: Equipment features high processing precision and stable operation for reliable performance.
Flexible Spindle Switching: Lower spindle carries product and switches between rough grinding and fine grinding positions.
1-Year Warranty: Comprehensive 1-year warranty coverage included with the machine purchase.
Quality Inspection Reports: Machinery test report and video outgoing inspection are provided for quality assurance.
High Power Efficiency: Equipped with 5.5 Kw power system for efficient grinding operations.
Floor-Standing Installation: Designed for floor-standing installation suitable for grinding industry applications.

Company profile

Nanjing New Donor Machinery Equipment Co., Ltd.
High Repeat Buyers ChoiceLow MOQFlexible Customization
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 2 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤5.21h

AI-Powered supplier vetting

SummaryNanjing New Donor Machinery Equipment Co., Ltd., based in Jiangsu, China, is a manufacturer specializing in heat exchangers and related products. The company operates as a limited entity and is part of a larger company group. It provides OEM services for well-known brands but lacks SDK availability for R&D. The supplier exports a significant portion of its sales, mainly through agents. While it emphasizes quality and innovation, specific certifications are not detailed. It has a modern quality management system and offers versatile customization services.
Supplier typeThe supplier is a manufacturer/factory, operating as a limited company in Jiangsu, China, and is part of a larger company group.
Financial creditThe supplier's financial information is available for the last three years, indicating a stable financial capacity.
Production capacityThe supplier has advanced production equipment and a high-standard quality control system, suggesting strong production capabilities.
Customization capabilityThe supplier offers extensive customization options, including full and minor customization from samples and designs.
Client casesThe supplier has a good reputation among domestic and international customers, implying successful customer cases.

Product Q&A

Q:What is the warranty period for this machine?
A:
The machine comes with a 1-year warranty.
Q:What is the maximum grinding wheel speed?
A:
The grinding wheel speed is 3000 Rpm.
Q:What is the lead time for delivery?
A:
Lead time is 3-6 months during peak season and 1-3 months during off-season.
Q:What payment terms are accepted?
A:
Accepted payment terms include LC, T/T, D/P, and PayPal.
Q:Is the machine suitable for silicon wafer production?
A:
Yes, it can build a complete silicon wafer production line with integrated grinding capabilities.

Send Inquiry

*To:Nanjing New Donor Machinery Equipment Co., Ltd.Nanjing New Donor Machinery Equipment Co., Ltd.
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