Powered by Made-in-China.com
Semiconductor Wafer Lapping Machine for Ultra Thin Wafer
US$7,000.00
2 Pieces
US$6,500.00
3+ Pieces
Product profile
Customization
AvailableWarranty
1-Year WarrantyType
Double Side Lapping MachineModel NO.
BWVoltage
380 VCNC or Not
CNCCore Components
PLCMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedPower (Kw)
5.5Weight (Kg)
1800Machining Accuracy
High PrecisionApplicable Industries
Grinding IndustryInstallation Method
Floor-StandingGrinding Wheel Speed
3000(Rpm)Specification
1700*1300*2170(mm)Trademark
BWOrigin
Jiangsu, ChinaKey features
High Precision Machining: Ensures accurate thickness control for ultra-thin semiconductor wafers.
Fully Closed-Loop Control: Utilizes PLC, grating ruler, and servo control for stable operation.
Integrated Grinding Process: Combines rough and fine grinding in a single integrated system.
Double Side Lapping Capability: Designed specifically for double-side lapping of semiconductor wafers.
1-Year Warranty Coverage: Includes comprehensive warranty protection for one year.
CNC Technology: Equipped with advanced CNC control for precise manufacturing.
Video Inspection Provided: Pre-shipment video inspection available for quality verification.
Machinery Test Report: Detailed test reports provided to verify machine performance.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 2 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤3.49h
AI-Powered supplier vetting
SummaryNanjing New Donor Machinery Equipment Co., Ltd. is identified as a China-based manufacturer/factory producing heat exchangers, fin tubes, and fin tube machines. The supplier reports OEM service for well-known brands, broad customization options, export activity, quality-management practices, and experienced technical and production teams. Its export sales share is stated as 71%–90%, but it began exporting only two years ago. Evidence is insufficient to confirm certifications, after-sales capability, financial strength, or customer cases. The supplier reports no available SDK, has four employees, and its raw-material traceability, environmental assessment, and fire-drill status are unknown. An audit by BV is documented with a validity period from June 25, 2025 to June 24, 2026, but the provided audit result value is not interpretable as a performance conclusion.
Supplier typeThe supplier is explicitly identified as a Manufacturer/Factory and a limited company in China, operating in manufacturing and processing machinery. Its stated products are heat exchangers, fin tubes, and fin tube machines.
R&D capabilityThe supplier states that it continuously develops safer, lighter, and more energy-saving products, pursues technological innovation, and conducts mechanical-equipment R&D. However, it reports no available SDK, and no measurable innovation output or R&D performance is provided.
Production capacityThe supplier is identified as a factory with a stated scientific management system, high-standard quality control, advanced production equipment, sophisticated testing equipment, and experienced technical and production teams. Its product scope covers heat exchangers, fin tubes, and fin tube machines, although the reported employee count is four.
Customization capabilityThe supplier explicitly supports customization from samples, designs, full customization, minor customization, and flexible customization. This provides direct evidence of broad customization coverage.
Product Q&A
Q:What is the warranty period for this machine?
A:
We provide a 1-year warranty for this semiconductor wafer lapping machine.
Q:Does this machine support double-side lapping?
A:
Yes, this is a Double Side Lapping Machine designed for ultra-thin wafers.
Q:What is the lead time for production?
A:
Lead time is 3-6 months during peak season and 1-3 months during off-season.
Q:Is video inspection available before shipment?
A:
Yes, a video outgoing-inspection is provided to ensure quality.
Q:What payment terms do you accept?
A:
We accept LC, T/T, D/P, and PayPal for payment.
Send Inquiry
*To:
Nanjing New Donor Machinery Equipment Co., Ltd.
Nanjing New Donor Machinery Equipment Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Likesmile Semiconductor Wafer Grinding Machine for Ultra Thin Wafer
US$6,500.00-7,000.00
1 Piece(MOQ)
Likesmile Semiconductor Silicon Wafer Lapping Machine for High Yield
US$6,500.00-7,000.00
1 Piece(MOQ)
CNC Wire Saw Machine for Semiconductor Wafer Processing
US$6,500.00-7,000.00
1 Piece(MOQ)
Likesmile Semiconductor Silicon Wafer Lapping Machine for IC Line
US$6,500.00-7,000.00
1 Piece(MOQ)
Likesmile Semiconductor Wafer Polishing Machine for Ultra Flat Wafer
US$7,000.00
1 Piece(MOQ)
IC Wafer Cleaning Machine for Semiconductor Manufacturing
US$6,500.00-7,000.00
1 Piece(MOQ)
Infrared Picosecond Laser Cutting Machine for UTG Ultra-Thin Glass
US$59,999.00-63,899.00
1 Piece(MOQ)
Semiconductor Wafer Wet Cleaning Machine for Silicon Wafer
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Cleaning Machine for Semiconductor Fab
US$6,500.00-7,000.00
1 Piece(MOQ)
Low Price Sale High Precision Cold Drawing Machine for Semiconductor Equipment Tube and High Purity Metal Pipe
US$10,000.00-80,000.00
1 Piece(MOQ)
Ultra-Precise Infrared Picosecond Laser Cutting Machine for Thick Glass Cutting
US$53,900.00-55,900.00
1 Piece(MOQ)
High Accuracy Laser Cutting Machine for Thin Metal Sheet Precision Processing Applications
US$3,000.00-50,000.00
1 Piece(MOQ)
Automatic Flange Hole Punching Machine for Ventilation, Semiconductor and Firefighting Purpose
US$22,000.00-30,000.00
1 Piece(MOQ)
High Speed Laser Cutting Machine for Thin Sheet Metal Production Line Applications
US$3,000.00-50,000.00
1 Piece(MOQ)
High Speed CNC Laser Cutting Machine for Thin Metal Sheet Production Applications
US$3,000.00-50,000.00
1 Piece(MOQ)
High Precision Cold Drawing Machine for Semiconductor Equipment Tube and High Purity Metal Pipe
US$10,000.00-80,000.00
1 Piece(MOQ)
Plasma Surface Treatment Machine for Wafer Processing
US$2,500.00-3,000.00
1 Piece(MOQ)
Ultra-Precise Picosecond Laser Cutting Machine for Sapphire Glass
US$59,999.00-63,899.00
1 Piece(MOQ)
One Feed PP/Pet Packing Strap Belt Macking Machine for Plastic Packaging
US$20,000.00-80,000.00
1 Set(MOQ)








