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Asm Ad830 Plus Die Bonding Machine Semiconductor Equipment Asmpt Die Bonder
US$100,000.00-1,000,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
Video Technical SupportCondition
NewModel NO.
ASM AD830 PlusSpeed
High SpeedPrecision
High PrecisionCertification
CCC, PSE, FDA, RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterDelivery
1-7 DaysMOQ
1 PCQuality
100% TestedAdaptation
Die BonderInventory
AvailabilityTransport Package
Plastic Bag&Carton BoxSpecification
1700 KGTrademark
ASMPTOrigin
GermanyHS Code
8479896200Production Capacity
5PCS/YearKey features
Ultra-high-speed die bonding with a cycle time of just 0.16s, achieving up to 22,000 UPH
FPrecision alignment system delivering 25.4 accuracy for precise die placement.
Quick changeover and versatility, supporting a wide range of die sizes and substrate types
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤5.00h
About Our Factory & Business Background
AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5
Our Production Capability & Technical Expertise
Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What products can you provide?
A:
semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample? what is your MOQ?
A:
Yes, sample is available, our MOQ is 1 piece
Q:How long will it take to deliver the goods?
A:
About 1 to 7 working days.
Q:What kinds of brands of parts can you provide?
A:
We have asm, besi,etc.
Q:What is the warranty of accessories?
A:
We provide 6 months` warranty on new accessories and 3 months on Second hand accessories, actual life depends on working and maintanance. If feeder can not work after newly received , free repalcement would be sent immediately or refund
Send Inquiry
*To:
Guangdong Xinling Industrial Co., Ltd
Guangdong Xinling Industrial Co., Ltd*Content:
Supplier replies will be sent to your registered email
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